Based on the requirements of multi-application function fusion, integration, and reconfigurability of integrated electronic equipment, this paper designs a comprehensive RF(Radio Frequency) microsystem for communication, navigation, reconnaissance, and other applications to achieve multiple functions such as telemetry, safety control, and data link. Based on the RF digital integration design method, we aim to achieve high-density integration of 8 heterogeneous chips across 5 process nodes, addressing issues such as wiring difficulties, limited isolation space resources, and difficulties in integrating heterogeneous chips. Adopting BGA1369 packaging, the packaging size is 37.5 mm × 37.5 mm × 3.97 mm. To meet the high reliability requirements of universal applications, establish a reliability assessment system for electricity, heat, and power, and achieve batch unmanned aging and life testing. Developing an operating system based on IP software-defined application method to meet the demand for multifunctional communication, navigation and reconnaissance. This system can achieve reconfigurable applications in different RF digital integration scenarios such as handheld telemetry terminals and flight communication systems, and meet the application requirements for convenient development.

In this paper, the advantages of the gold ribbon welding connection technology over solder connection technology are described, and the effects of different sizes and positions of gold ribbon welding on electrical transmission performance were analyzed by simulation technology. Through a series of orthogonal tests, the paper shows how the three parameters of spot welding voltage, spot welding time and electrode pressure affected the welding effect during the spot welding process between gold strip and substrate and adapter. The formation mechanism of different fracture modes and the mechanism of smoke generation were analyzed, and the relationship between single parameter and welding breaking force is revealed. Finally, the optimized process parameters are obtained. The optimized process parameters were used to produce the gold ribbon according to the specified process steps, and the excellent performance of the ribbon was verified by the high and low temperature cycle test and the electrical property test.

To meet the requirements for miniaturization, broadbandization, integration, and Electro Magnetic Compatibility(EMC) in radar and communication systems，the ceramic nesting technology was used to design and fabricate a low-loss X-band Surface Mount Technology (SMT) microstrip circulator based on Mg ferrite materials. Through three-dimensional full electromagnetic simulation, a microstrip gyro-magnetic junction with comb structure was designed to achieve device miniaturization and broadbandization. To realize SMT packaging, a ceramic-filled metallized via structure was optimally designed using HFSS, and the St12 metal with high permeability was used as a shielding cover to ensure that the circulator can work independently without interference from other components in the system, achieving electromagnetic shielding and magnetic conduction. Finally, the device was fabricated and tested according to the optimal design results. The test results demonstrated that the designed SMT circulator had a full package size of 6 mm×6 mm×4 mm, with a bandwidth of 60%, Loss<0.8 dB, Isolation>18 dB, and VSWR<1.30. The resulting circulator shows no electromagnetic interference with the outside world, and is suitable for large-scale automatic mounting.

This paper mainly focuses on the thermal deformation of microwave components during reflow soldering. Firstly, the"birth-death setting" of the contact pairs was utilized to accurately simulate the dynamic constraint relationship between the shell and PCB(the Printed Circuit Board), a thermal-mechanical sequential coupling simulation method was adopted to conduct a simulation analysis of the thermal deformation of microwave components during the reflow soldering process. Then, through the comparative analysis of the simulation and actual test results, it is found that the error between the simulation results and the measured results is within 10%, thus verifying the effectiveness and accuracy of this simulation method. Finally, analyses and studies were conducted on the influencing factors such as structural stiffness, solder thickness, soldering temperature, and material combinations. Through the research in this paper, the thermal deformation of microwave components during reflow soldering can be accurately predicted at the initial stage of design. Meanwhile, the analysis and study of several typical influencing factors can provide clear guidance for subsequent design optimization, offering references and examples for improving the reliability of reflow soldering of microwave components.

This paper designs a miniaturized ultra-wideband variable frequency converter for the Ka -band and focuses on breaking through key technologies for advanced packaging for the Ka-band. In this paper, a ball grid array(BGA) three-dimensional packaging technique is used to achieve multi-chip integration, and a multi-channel wavelength converter compensation circuit for Ka-band is designed, and the vertical transmission of Ka frequency radio signals by BGA within the 32 to 38 GHz band is successfully achieved, further improving the integration of the packaging. A high performance 3D substrate-integrated transmission structure is designed to meet the need of high isolation for interconnection between 3D package modules. For the long-distance coaxial transmission structure, a hierarchical compensation design is adopted to ensure the transmission performance, the plane size of the interconnection structure is reduced by 70% and the inter-line isolation is increased by more than 30 dB. The test results show that the technical specifications of the frequency conversion module are basically consistent with the design results, which provides important guidance and reference for the application of advanced packaging technology in ultra-wideband millimeter wave band.

With the development of measurement and control technology, the Ka-band has become an important direction for the development of next-generation satellite communications and millimeter-wave radar. Low-noise amplifiers are core components at the front end of receivers, and their noise temperature directly affects key system indicators such as the receiving sensitivity and action distance of the system. This paper introduces an ultra-low-noise temperature amplifier working in the Ka-band, achieving ultra-wideband, ultra-low noise temperature, miniaturization and generalization. The measured results show that within the frequency range of 26.5～40 GHz, the gain is more than 35 dB, the noise temperature is less than 215 K, and the VSWR is less than 2.38 with the size of 32 mm×19 mm×8 mm.

By optimizing the reference impedance of the T-junction power divider and reducing the impedance mutation, the working bandwidth is significantly broadened. A one-to-four T-junction broadband power divider with a center frequency of 15 GHz is designed. Its structure is mainly composed of T-junctions and microstrip transmission lines, with a size of 25×3.8 mm². The simulation results show that, without increasing the network size and complexity, compared with the traditional four-way power divider, the working bandwidth defined by the 20 dB return loss is broadened to 3.44 octaves (6.5 ~ 24 GHz). Within the working frequency band, the insertion loss is less than 6.7 dB (including the theoretical 6 dB loss of one-to-four division). A prototype is fabricated and tested, and the measured results are in good agreement with the simulation results. This power divider features a “narrow and long”structure, making it suitable for use in broadband one-dimensional array antennas such as those in mobile communication base stations and radars, and it has a promising application prospect.

The objective of coverage path planning is to ensure that Unmanned Aerial Vehicles (UAVs) achieve complete coverage of the target area. Previous studies assigned UAVs the task of covering each sub-area separately. However, this study proposes a new methodology in which two UAVs collaborate across the entire search area, achieving coverage tasks more flexibly while enhancing efficiency. This paper aims to address the high cost of traditional UAV coverage path planning by proposing a dual-UAVcoverage path planning algorithm based on Q-Learning. To reduce the time taken for the process, a grid-based rotating area partitioning algorithm is used to minimize the search area. The path planning is transformed into a multi-objective function optimisation problem, and the Double-Q-Learning algorithm balances global search and local exploitation, iteratively optimising the path with a total cost function that considers distance and turning costs. The simulation results demonstrate that the proposed algorithm can achieve complete coverage of different target areas with a lower total cost.

To address the prevalent issues of poor hardware platform versatility and high redundancy development in China's arrow-borne telemetry transmitters, this paper proposes a novel universal design methodology based on operational requirements analysis of existing equipment. By constructing a dynamic reconfigurable intelligent software architecture, diverse mission requirements across different models can be achieved on a universal hardware platform. When mission parameters change, hardware circuit redesign is eliminated; instead, functional updates and parameter adjustments are accomplished via external serial communication with a ground station. Compared to conventional dynamic reconfiguration techniques that only support static parameter modification, this architecture enables real-time online updates and software reconfiguration of telemetry transmitters. Leveraging a crewed spaceflight mission as an engineering case, a multi-code rate arrow-borne telemetry transmitter is developed, with key technologies including universal hardware platform design, real-time health monitoring, and dynamic reconfigurable software architecture thoroughly investigated. Experimental results demonstrate that the proposed solution achieves high integration, autonomous control of domestically produced chips, and real-time health monitoring accuracy. Successful maiden flight validation confirms its engineering feasibility, providing an innovative technical pathway for next-generation arrow-borne telemetry systems.

In response to the high reliability requirements of missile-borne equipment in complex mechanical environments, a design method for vibration isolators based on high-manganese copper alloy is proposed. Firstly, a dynamic model of the missile-borne equipment was established, and the damping characteristics of the high-manganese copper alloy were thoroughly analyzed to determine its damping parameters. Subsequently, to balance the damping and strength properties of the vibration isolator, an optimization design model for the missile-borne equipment vibration isolator based on high-manganese copper alloy was constructed. The genetic algorithm was employed to optimize the relevant design parameters of the vibration isolator, resulting in an improved design scheme. Finite element analysis and mechanical testing demonstrates that, compared to traditional silicone rubber vibration isolators, the deformation of the high-manganese copper alloy-based vibration isolator was reduced by 40%, while its damping characteristics still met the vibration isolation requirements of the missile-borne equipment. This fully proves the superiority and rationality of the proposed design scheme.