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Design and Implementation of GNC Information Processing Microsystem Circuit
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Yunhe LIAN, Chao WU, Nanzhong HU
Journal of Telemetry, Tracking and Command | 2025, 46(2) : 41 - 47
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Journal of Telemetry, Tracking and Command | 2025, 46(2): 41-47
TT & C Communication and Navigation
Design and Implementation of GNC Information Processing Microsystem Circuit
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Yunhe LIAN, Chao WU, Nanzhong HU
Affiliations
  • China Electronics Technology Group Corporation No58 Research Institute, Wuxi 214072, China
Published: 2025-03-15 doi: 10.12347/j.ycyk.20241113001
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With the ongoing advancements in equipment informatization and lightweight design, the development of navigation guidance and control (GNC) systems faces escalating complexity, while demands for system miniaturization and weight reduction grow increasingly urgent. System-in-Package (SiP), a high-density integrated packaging technology, addresses these challenges by encapsulating multiple functional chips into compact cavities, thereby achieving enhanced integration and system miniaturization. To meet the miniaturization requirements of GNC systems, this study presents a GNC information processing microsystem circuit designed using SiP technology. The circuit employs a DSP+FPGA architecture, integrates diverse interface and memory chips, and leverages mature ceramic substrate microsystem integration techniques. Comprehensive multi-physics simulations were conducted to validate the design. Experimental results demonstrate normal circuit functionality and full compliance with design specifications. Compared to the prototype verification board, the optimized circuit exhibits dimensions of 45 mm×45 mm×11 mm and a weight of approximately 60 g. Substituting traditional board-level systems with this circuit significantly improves product integration and fulfills critical miniaturization requirements for control systems.

SiP  /  GNC  /  Multi physics field simulation  /  Miniaturization  /  Microsystem  /  Circuit
Yunhe LIAN, Chao WU, Nanzhong HU. Design and Implementation of GNC Information Processing Microsystem Circuit[J]. Journal of Telemetry, Tracking and Command, 2025 , 46 (2) : 41 -47 . DOI: 10.12347/j.ycyk.20241113001
Year 2025 volume 46 Issue 2
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doi: 10.12347/j.ycyk.20241113001
  • Receive Date:2024-11-13
  • Online Date:2026-03-13
  • Published:2025-03-15
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  • Received:2024-11-13
  • Revised:2025-01-10
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    China Electronics Technology Group Corporation No58 Research Institute, Wuxi 214072, China
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表12种不同金属材料的力学参数

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Number of
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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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