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This paper mainly focuses on the thermal deformation of microwave components during reflow soldering. Firstly, the"birth-death setting" of the contact pairs was utilized to accurately simulate the dynamic constraint relationship between the shell and PCB(the Printed Circuit Board), a thermal-mechanical sequential coupling simulation method was adopted to conduct a simulation analysis of the thermal deformation of microwave components during the reflow soldering process. Then, through the comparative analysis of the simulation and actual test results, it is found that the error between the simulation results and the measured results is within 10%, thus verifying the effectiveness and accuracy of this simulation method. Finally, analyses and studies were conducted on the influencing factors such as structural stiffness, solder thickness, soldering temperature, and material combinations. Through the research in this paper, the thermal deformation of microwave components during reflow soldering can be accurately predicted at the initial stage of design. Meanwhile, the analysis and study of several typical influencing factors can provide clear guidance for subsequent design optimization, offering references and examples for improving the reliability of reflow soldering of microwave components.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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