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Tuning Trace Elements to Improve High-temperature Oxidation Resistance of Oxygen-free Copper Wire
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Fengli YUE1, Yuhang LIU1, Songwei WANG2, Hongwu SONG2, Shuyao PENG3, Jianping HUO3, Xiaofei PENG3
Copper Engineering | 2026, (2) : 108 - 116
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Copper Engineering | 2026, (2): 108-116
Extraction Metallurgy and Chemical Engineering
Tuning Trace Elements to Improve High-temperature Oxidation Resistance of Oxygen-free Copper Wire
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Fengli YUE1, Yuhang LIU1, Songwei WANG2, Hongwu SONG2, Shuyao PENG3, Jianping HUO3, Xiaofei PENG3
Affiliations
  • 1.School of Automative and Transportation,Shenyang Ligong University,Shenyang 110159,China
  • 2.Shichangxu Advanced Materials Innovation Center,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China
  • 3.Jiangxi MicroBlue Electronic & Technology Co.,Ltd.,Ji'an 343000,China
Published: 2026-04-28 doi: 10.3969/j.issn.1009-3842.2026.02.011
Outline
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To enhance the high-temperature oxidation resistance of high-purity oxygen-free copper wire, this study prepared copper wires using 6N high-purity copper as the matrix with trace additions of Ag, P, Cr and Ni. Oxidation behavior of the wires in air at 300, 400, and 500 ℃ was systematically investigated. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) were employed to analyze the morphology, thickness, and phase composition of the oxide films. Results indicated that the introduction of trace elements significantly affected the characteristics of the oxide films. Ag addition thickened the oxide film and promoted formation of CuO at high temperatures. P incorporation refined the oxide film structure and inhibited oxygen diffusion. Synergistic effect of Cr and Ni effectively enhanced the density of the oxide film and promoted Cu2O formation, significantly strengthening the texture of Cu(111) and other crystal planes, thereby improving overall oxidation resistance.

pure copper wire  /  microalloying  /  antioxidant activity  /  trace element  /  oxide film
Fengli YUE, Yuhang LIU, Songwei WANG, Hongwu SONG, Shuyao PENG, Jianping HUO, Xiaofei PENG. Tuning Trace Elements to Improve High-temperature Oxidation Resistance of Oxygen-free Copper Wire[J]. Copper Engineering, 2026 , (2) : 108 -116 . DOI: 10.3969/j.issn.1009-3842.2026.02.011
Year 2026 volume Issue 2
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.02.011
  • Receive Date:2025-07-31
  • Online Date:2026-09-09
  • Published:2026-04-28
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History
  • Received:2025-07-31
  • Revised:2025-10-27
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Affiliations
    1.School of Automative and Transportation,Shenyang Ligong University,Shenyang 110159,China
    2.Shichangxu Advanced Materials Innovation Center,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China
    3.Jiangxi MicroBlue Electronic & Technology Co.,Ltd.,Ji'an 343000,China
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https://castjournals.cast.org.cn/joweb/tygc/EN/10.3969/j.issn.1009-3842.2026.02.011
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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