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Recent Progress on Preparation of Cadmium Zinc Telluride Thin Films
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Mengshi YU1, 2, Siqi HU2, Yangyang HUAI2
Copper Engineering | 2026, (1) : 1 - 18
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Copper Engineering | 2026, (1): 1-18
Material Preparation and Process Engineering
Recent Progress on Preparation of Cadmium Zinc Telluride Thin Films
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Mengshi YU1, 2, Siqi HU2, Yangyang HUAI2
Affiliations
  • 1.Jiangxi Copper Corporation Limited,Nanchang 330096,China
  • 2.Jiangxi Copper Technology Institute Co.,Ltd.,Nanchang 330096,China
Published: 2026-02-28 doi: 10.3969/j.issn.1009-3842.2026.01.001
Outline
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Cadmium zinc telluride (CdZnTe) thin films, characterized by a high atomic number, tunable optical bandgap, and excellent photoelectric conversion performance, hold significant potential in advanced applications such as thin-film photovoltaic cells, infrared imaging, and high-energy radiation detection. However, achieving low-cost fabrication and high-quality film formation remains a critical challenge for their industrial deployment. In this work, we systematically reviewed the vapor deposition techniques for CdZnTe thin films. While methods such as physical vapor transport, vacuum thermal evaporation, hot-wall epitaxy, magnetron sputtering, and close spaced sublimation offer advantages in simplicity and cost-effectiveness, they suffer from issues such as poor film uniformity and high lattice defect density. In contrast, molecular beam epitaxy and metal-organic chemical vapor deposition enable atomic-level precision and superior lattice integrity, but are constrained by high process costs and complex equipment, limiting their scalability. To enhance the quality of CdZnTe thin films, this work highlighted three key optimization strategies: (1) refining growth parameters for precise process control, (2) improving heteroepitaxial quality through interfacial buffer layer design, and (3) mitigating intrinsic defects via annealing treatments. Ultimately, we concluded that balancing film performance with production costs and overcoming the technical challenges of large-area uniform film deposition would be critical for the future advancement of CdZnTe thin films.

cadmium zinc telluride thin film  /  vapor deposition  /  growth parameter  /  interfacial buffer layer  /  annealing treatment
Mengshi YU, Siqi HU, Yangyang HUAI. Recent Progress on Preparation of Cadmium Zinc Telluride Thin Films[J]. Copper Engineering, 2026 , (1) : 1 -18 . DOI: 10.3969/j.issn.1009-3842.2026.01.001
Year 2026 volume Issue 1
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.01.001
  • Receive Date:2025-06-19
  • Online Date:2026-09-08
  • Published:2026-02-28
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History
  • Received:2025-06-19
  • Revised:2025-10-17
Funding
Affiliations
    1.Jiangxi Copper Corporation Limited,Nanchang 330096,China
    2.Jiangxi Copper Technology Institute Co.,Ltd.,Nanchang 330096,China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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