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Microstructure and Properties of Cu/Stainless Steel Bimetallic Composites by Cold Rolling
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Chong WANG1, Qian LEI1, Wenting QIU2, Ying ZHANG2, Tianlai CHEN2
Copper Engineering | 2026, (1) : 30 - 41
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Copper Engineering | 2026, (1): 30-41
• Material Preparation and Process Engineering •
Microstructure and Properties of Cu/Stainless Steel Bimetallic Composites by Cold Rolling
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Chong WANG1, Qian LEI1, Wenting QIU2, Ying ZHANG2, Tianlai CHEN2
Affiliations
  • 1.State Key Laboratory for Powder Metallurgy，Central South University，Changsha 410083，China
  • 2.Zhongjin Lingnan Technology Co.，Ltd.，Shenzhen 518122，China
Published: 2026-02-28 doi: 10.3969/j.issn.1009-3842.2026.01.003
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With the shortage of copper resources, bimetal matrix composites partly replacing copper with steel have high economic value. To combine high thermal conductivity of copper with high strength of stainless steel, this paper successfully prepared T1 copper/316L stainless steel composites by single-pass cold rolling. Effects of annealing temperature on the microstructure and properties of T1 Cu/316L stainless steel composites were studied by scanning electron microscopy, hardness tests, tensile tests, tensile shear tests and electrical conductivity tests. Results showed that annealing can eliminate interface defects and improve interface structure. With the increase of annealing temperature, hardness and strength of copper/stainless steel composite materials gradually decreased, while elongation gradually increased, and electrical conductivity improved. After annealing at 700 ℃ for 2 h, excellent comprehensive properties can be obtained, with a yield strength of 539 MPa, a tensile strength of 689 MPa, an elongation of 33%, a shear strength of 191 MPa, and an electrical conductivity of 54.9%IACS.

copper/stainless steel bimetallic composite  /  cold rolling  /  annealing treatment  /  mechanical property  /  binding mechanism
Chong WANG, Qian LEI, Wenting QIU, Ying ZHANG, Tianlai CHEN. Microstructure and Properties of Cu/Stainless Steel Bimetallic Composites by Cold Rolling[J]. Copper Engineering, 2026 , (1) : 30 -41 . DOI: 10.3969/j.issn.1009-3842.2026.01.003
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.01.003
  • Receive Date：2025-06-14
  • Online Date：2026-09-08
  • Published：2026-02-28
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History
  • Received：2025-06-14
  • Revised：2025-10-14
Funding
Affiliations
    1.State Key Laboratory for Powder Metallurgy，Central South University，Changsha 410083，China
    2.Zhongjin Lingnan Technology Co.，Ltd.，Shenzhen 518122，China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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