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Defect Analysis of C19400 Copper Alloy Strip
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Yinghui WEI1, 2, Huijie LIANG1, 2, Wei LIU1, 2, Shengli CHAI1, 2, Jundong LÜ1, 2, Jingzhao YANG1, 2
Copper Engineering | 2026, (1) : 19 - 29
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Copper Engineering | 2026, (1): 19-29
Material Preparation and Process Engineering
Defect Analysis of C19400 Copper Alloy Strip
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Yinghui WEI1, 2, Huijie LIANG1, 2, Wei LIU1, 2, Shengli CHAI1, 2, Jundong LÜ1, 2, Jingzhao YANG1, 2
Affiliations
  • 1.Shanxi Key Laboratory of Copper-Based New Materials,Yuncheng 044000,China
  • 2.Shanxi North Copper New Material Technology Co.,Ltd.,Yuncheng 044000,China
Published: 2026-02-28 doi: 10.3969/j.issn.1009-3842.2026.01.002
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Surface defects in C19400 copper-iron alloys significantly degrade both electrical conductivity and mechanical properties, posing a key limitation on their application in high-end semiconductor packaging and electronic components. In this paper, origins and microscopic morphology of compositional defects in C19400 copper strips were systematically investigated. Distribution behavior of elements in the copper matrix was first predicted using Miedema model for thermodynamic calculations of Cu-Fe-P system. Subsequently, the defective samples were characterized in terms of microstructure and composition through methods including spark discharge optical emission spectrometry, scanning electron microscopy, and energy-dispersive spectroscopy. Results revealed the presence of various inclusion defects and precipitation in C19400 copper strips. Specifically, oxide inclusions appeared as irregular flakes; carbides aggregated as dark fine particles in localized areas; phosphides were distributed inside pits; hard inclusions were embedded as irregular particles within the pits, and precipitates aligned in elongated forms along the rolling direction. Traceability analysis indicated that compositional defects introduced during the melting and casting stages remained through manufacturing process to strip stage. Subsequent rolling and annealing treatments further altered the size and distribution of these inclusions. This study clarified the evolution path and microstructural characteristics of these defects, providing a theoretical and experimental basis for optimizing processing of C19400 and enhancing reliability of this material in high-end electronic applications.

C19400 copper strip  /  composition defect  /  microstructure  /  inclusion  /  performance analysis
Yinghui WEI, Huijie LIANG, Wei LIU, Shengli CHAI, Jundong LÜ, Jingzhao YANG. Defect Analysis of C19400 Copper Alloy Strip[J]. Copper Engineering, 2026 , (1) : 19 -29 . DOI: 10.3969/j.issn.1009-3842.2026.01.002
Year 2026 volume Issue 1
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.01.002
  • Receive Date:2025-06-03
  • Online Date:2026-09-08
  • Published:2026-02-28
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  • Received:2025-06-03
  • Revised:2026-01-13
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    1.Shanxi Key Laboratory of Copper-Based New Materials,Yuncheng 044000,China
    2.Shanxi North Copper New Material Technology Co.,Ltd.,Yuncheng 044000,China
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https://castjournals.cast.org.cn/joweb/tygc/EN/10.3969/j.issn.1009-3842.2026.01.002
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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