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Effects of Cold Rolling Reduction Rate Distribution on Microstructure and Properties of Oxygen-Free Copper Strip
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Tongsheng Hu1, 3, Jing Qin2, 3, Tingting Fu1, 3, Chen Zhou1, 3
Copper Engineering | 2026, (4) : 118 - 125
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Copper Engineering | 2026, (4): 118-125
Material Preparation and Process Engineering
Effects of Cold Rolling Reduction Rate Distribution on Microstructure and Properties of Oxygen-Free Copper Strip
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Tongsheng Hu1, 3, Jing Qin2, 3, Tingting Fu1, 3, Chen Zhou1, 3
Affiliations
  • 1.Tongling Jinvi Copper Corporation,Tongling Nonferrous Metals Group Co.,Ltd.,Tongling 244000,China
  • 2.School of Materials Science and Engineering,Tongling University,Tongling 244000,China
  • 3.Anhui Joint Key Laboratory of Critical Technologies for High-End Copper-Based New Materials,Tongling 244000,China
Published: 2026-08-28 doi: 10.3969/j.issn.1009-3842.2026.04.014
Outline
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As core conductor materials for high-end electronic components and power transmission systems, oxygen-free copper strips require increasingly stringent performance specifications to meet diverse application demands. During cold rolling, different reduction rate distribution significantly influences material properties through microstructure transformation including grain orientation, dislocation density, and texture evolution. Under identical total deformation conditions, this study investigated effects of different cold rolling reduction rate distribution schemes on microstructure, texture, and performance of the material. Results showed that reducing the number of rolling can reduce the number of intermediate annealing and increase reduction rate of each rolling, which enhanced energy storage and nucleation sites formation to elevate recrystallization nucleation rates, ultimately leading to smaller final grain sizes. Increasing single reduction rates improved the proportion of various deformation textures, enhancing product microstructural uniformity. When single reduction rate exceeded 80%, orientation density of {112}<111>(copper), {110}<112>(brass), and {123}<634>(S) deformation textures was significantly enhanced, promoting the formation of strong {001}<100>(cube) textures during recrystallization annealing. Higher cube texture proportions contributed to lower microhardness and slightly improved conductivity of oxygen-free copper strips. The results provided a theoretical basis for adjustment of production process and optimization of product properties of oxygen-free copper strip.

oxygen-free copper strip  /  microstructure  /  texture  /  cold rolling  /  reduction rate
Tongsheng Hu, Jing Qin, Tingting Fu, Chen Zhou. Effects of Cold Rolling Reduction Rate Distribution on Microstructure and Properties of Oxygen-Free Copper Strip[J]. Copper Engineering, 2026 , (4) : 118 -125 . DOI: 10.3969/j.issn.1009-3842.2026.04.014
Year 2026 volume Issue 4
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.04.014
  • Receive Date:2025-12-29
  • Online Date:2026-09-08
  • Published:2026-08-28
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History
  • Received:2025-12-29
  • Revised:2026-04-21
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Affiliations
    1.Tongling Jinvi Copper Corporation,Tongling Nonferrous Metals Group Co.,Ltd.,Tongling 244000,China
    2.School of Materials Science and Engineering,Tongling University,Tongling 244000,China
    3.Anhui Joint Key Laboratory of Critical Technologies for High-End Copper-Based New Materials,Tongling 244000,China
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https://castjournals.cast.org.cn/joweb/tygc/EN/10.3969/j.issn.1009-3842.2026.04.014
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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