C19210 is one of the Cu-Fe-P alloys extensively employed in the electronics industry. In order to enhance strength and electrical conductivity of the alloy, thermo-mechanical treatment was applied. In this work, the influences of deformation heat treatment on the mechanical properties, electrical conductivity, and microstructure of C19210 were investigated. Results showed that the optimal properties, including a Vickers hardness of 134HV, tensile strength of 445 MPa, electrical conductivity of 88.4%IACS, and elongation of 16.3%, can be achieved through an optimized combinatorial process: solution treatment at 900 ℃ for 120 min, primary cold rolling (80% reduction) with aging at 450 ℃ for 240 min, followed by secondary cold rolling (50% reduction) and aging at 450 ℃ for 60 min. Microstructural observations revealed that combined effects of precipitation strengthening from dispersed precipitates and grain refinement from fine recrystallized grains contributed to the improvement of strength and electrical conductivity. These findings provided a theoretical and practical foundation for optimizing the performance and engineering application of Cu-Fe-P alloys.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |