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Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites
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Huilong TAO1, Jin BAI1, Yuchun HUAN1, Min WANG1, 2
Copper Engineering | 2026, (2) : 55 - 65
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Copper Engineering | 2026, (2): 55-65
• Material Preparation and Process Engineering •
Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites
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Huilong TAO1, Jin BAI1, Yuchun HUAN1, Min WANG1, 2
Affiliations
  • 1.College of Materials Science and Technology，Nanjing University of Aeronautics and Astronautics，Nanjing 210016，China
  • 2.State Key Laboratory of Mechanics and Control for Aerospace Structures，Nanjing 210016，China
Published: 2026-04-28 doi: 10.3969/j.issn.1009-3842.2026.02.006
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The poor thermal stability of metallic copper limits its applications. This study fabricated graphene-encapsulated fine-grained copper composites via chemical vapor deposition (CVD) and investigated graphene growth on fine-grained copper (about 1 μm diameter). Results showed that pure copper's grain size increased from 2.03 μm (600 ℃) to 18.2 μm (1000 ℃), with hardness decreasing from 91.56HV to 27.64HV. Interestingly, graphene-encapsulated composites maintained stable grain size distribution (1.25~1.35 μm) and hardness distribution (83.96~100.63HV) across the different temperatures. These findings demonstrated that the graphene encapsulation on fine-grained copper significantly enhanced thermal stability by inhibiting copper atom diffusion. Furthermore, the drawn composite wires fabricated from the graphene-encapsulated copper composites by annealing at 1000 ℃ showed a 53.9% increase in hardness, a 12% improvement in tensile strength, a 29.8% higher elongation, and a 6.8% reduction in electrical resistivity compared with the counterpart produced from pure copper. This work provided new insights for fabricating copper-based composites with superior thermal stability.

fine-grained copper  /  graphene  /  copper-based composite  /  thermal stability  /  atomic diffusion  /  mechanical property  /  electrical property
Huilong TAO, Jin BAI, Yuchun HUAN, Min WANG. Fabrication of Thermally Stable Graphene-encapsulated Fine-grained Copper Composites[J]. Copper Engineering, 2026 , (2) : 55 -65 . DOI: 10.3969/j.issn.1009-3842.2026.02.006
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Year 2026 volume Issue 2
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Article Info
doi: 10.3969/j.issn.1009-3842.2026.02.006
  • Receive Date：2025-07-30
  • Online Date：2026-09-09
  • Published：2026-04-28
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  • Received：2025-07-30
  • Revised：2025-11-01
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Affiliations
    1.College of Materials Science and Technology，Nanjing University of Aeronautics and Astronautics，Nanjing 210016，China
    2.State Key Laboratory of Mechanics and Control for Aerospace Structures，Nanjing 210016，China
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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