Ceramic particle reinforced copper matrix composites have demonstrated broad application prospects in fields such as electronic packaging, aerospace, and rail transportation owing to their outstanding comprehensive properties. Incorporation of ceramic particles not only significantly enhances strength, hardness, and wear resistance of the copper matrix but also largely preserves its excellent electrical and thermal conductivity. In recent years, with the continuous advancement of fabrication technologies and characterization techniques, understanding of interfacial structures and interaction mechanisms between ceramic particles and the copper matrix has deepened considerably. Current research efforts mainly focus on precisely optimizing processing parameters and rationally designing the type and distribution characteristics of the reinforcing phases to maximize strengthening effects of ceramic particles within the copper matrix. Therefore, this review systematically summarized fabrication methods (internal oxidation, mechanical alloying, reactive spray deposition, powder metallurgy, additive manufacturing, stirring casting) of ceramic particle reinforced copper matrix composites. Influence of ceramic particle characteristics (type, content, particle size, interface bonding) on composite performance was analyzed. Electrical conduction and strengthening mechanisms were elucidated. Finally, existing challenges and future research directions were discussed, aiming to provide valuable insights for the further development and practical application of high-performance ceramic particle reinforced copper matrix composites.