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Fast Growth of Centimeter-Scale Molybdenum Disulfide Single Crystal for Energy-Efficient Logic Circuits
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Biyuan Zheng1, 2, Hui Wang1, Yizhe Wang1, Weihao Zheng2, Yong Liu1, Guangcheng Wu1, Miaomiao Li2, Sha Wang1, Xingxia Sun1, Chenguang Zhu1, Xin Yang1, Zheyuan Xu1, Mengjian Zhu2, Li Xiang1, *, Dong Li1, *, Anlian Pan1, 3, *
Research. Vol 9 Article ID 1117
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Research. Vol 9 Article ID 1117
• RESEARCH ARTICLE •
Fast Growth of Centimeter-Scale Molybdenum Disulfide Single Crystal for Energy-Efficient Logic Circuits
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Biyuan Zheng1, 2, Hui Wang1, Yizhe Wang1, Weihao Zheng2, Yong Liu1, Guangcheng Wu1, Miaomiao Li2, Sha Wang1, Xingxia Sun1, Chenguang Zhu1, Xin Yang1, Zheyuan Xu1, Mengjian Zhu2, Li Xiang1, *, Dong Li1, *, Anlian Pan1, 3, *
Affiliations
  • 1Hunan Institute of Optoelectronic Integration, State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle, College of Materials Science and Engineering, Hunan University, Changsha 410082, China.
  • 2College of Advanced Interdisciplinary Studies & Hunan Provincial Key Laboratory of Novel Nano-Optoelectronic Information Materials and Devices, National University of Defense Technology, Changsha 410073, China.
  • 3School of Physics and Electronics, Hunan Normal University, Changsha 410081, China.
About Author:

† These authors contributed equally to this work.

Published: 2026-01-20 doi: 10.34133/research.1117
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Two-dimensional transition metal dichalcogenides (TMDs) are promising candidates for next-generation electronics, but their future application is hindered by the inherently slow growth kinetics of conventional vapor deposition methods, particularly for the synthesis of large-area single-crystal films. Here, we demonstrate a source-confined chemical vapor deposition strategy that enables the fast synthesis of centimeter-scale MoS2 single-crystal films within just 10 min. An optimized sandwich-structured Mo source was employed to ensure a concentration-balanced metal supply under sodium chloride catalysis, followed by sulfurization to form MoS2. The films nucleate uniformly and directionally on the miscut C/A sapphire substrate positioned 2 cm upstream of the Mo source, achieving high crystal quality with a low sulfur vacancy density of 8.49 × 1012 cm−2. Additionally, these films support the development of high-performance enhancement-mode MoS2 field-effect transistors, exhibiting excellent transport performances, including a high on–off ratio of 108, an average positive threshold voltage of 1.71 ± 0.32 V, an average mobility of 34.28 ± 0.46 cm2 V−1 s−1, and an average subthreshold swing of 155.8 ± 33.7 mV dec−1. Furthermore, high-performance rail-to-rail inverter gates and logic circuits with low power consumption (<0.3 nW) were successfully demonstrated, underscoring the potential of these MoS2 films for integrated circuit applications. This work offers a scalable and reliable approach for the fast growth of large-scale TMDs single-crystal films, accelerating their future applications in next-generation electronics.

Biyuan Zheng, Hui Wang, Yizhe Wang, Weihao Zheng, Yong Liu, Guangcheng Wu, Miaomiao Li, Sha Wang, Xingxia Sun, Chenguang Zhu, Xin Yang, Zheyuan Xu, Mengjian Zhu, Li Xiang, Dong Li, Anlian Pan. Fast Growth of Centimeter-Scale Molybdenum Disulfide Single Crystal for Energy-Efficient Logic Circuits[J]. Research, 2026 , 9 (1) : 1117 - . DOI: 10.34133/research.1117
The scaling of silicon integrated circuits (ICs) is gradually approaching its limit due to the drain-induced barrier lowering, mobility degradation, high off-state currents, and power consumption increase caused by the short-channel effect. Atomically thin 2-dimensional (2D) transition metal dichalcogenides (TMDs) semiconductors, such as MoS2, featuring dangling-bond-free surfaces, excellent mechanical properties, flexibility, and outstanding optoelectronic properties, are regarded as promising channel materials for future ICs [1–7]. Drawing on the lessons from the development of silicon-based circuits, achieving fast growth of high-quality MoS2 single-crystal films is crucial for realizing its practical applications. However, achieving fast growth of TMDs single-crystal films remains an important technological challenge.
Extensive research efforts have culminated in the successful fabrication of triangular MoS2 nanosheets and continuous films using numerous methods [8–12]. The chemical vapor deposition (CVD) method exhibits distinct advantages for synthesizing high-quality MoS2 single-crystal films, making it a highly promising candidate for practical applications. Recently, considerable progress has been achieved in the preparation of MoS2 via low-pressure CVD (LPCVD), including the successful synthesis of wafer-scale single-crystal films through the merging of multiple single-oriented MoS2 domains [11–19]. However, several challenges remain unresolved in this field. For instance, achieving fast growth is difficult. In current LPCVD processes for synthesizing inch-scale MoS2 single-crystal films, the large separation distance (>30 cm) between the metal precursor source and the substrate leads to inadequate reactant concentration. This results in an extended synthesis time of 30 to 60 min and low growth rates of less than 0.5 cm2 min−1 [11,12,15,16,19]. A stable, efficient, and well-balanced precursor supply is essential for substantially reducing the growth time, which is a critical factor in enabling the fast growth of MoS2 films. Therefore, optimizing the growth process and minimizing the synthesis duration are crucial for the production and practical deployment of large-area MoS2 single-crystal films. Furthermore, field-effect transistors (FETs) made from wafer-scale LPCVD-grown MoS2 films typically exhibit depletion-mode operation (D-mode, indicated by a large negative threshold voltage [VTH] and drain current at zero gate voltage), a direct consequence of their intrinsic n-type doping [11,13,15,16]. The utilization of such D-mode devices requires the integration of either additional negative bias circuitry or complex compensation circuits to ensure proper switching operation. Consequently, the development of enhancement-mode (E-mode) FETs based on high-quality MoS2 is of critical importance, as they enable the construction of rail-to-rail inverter gates with superior noise margins and ultralow power consumption.
In this work, we developed a metal source-confined Mo source (Mo foil/MoO3 + NaCl/Mo foil) and strategically positioned it downstream of the sapphire substrate to enable the fast growth of the high-quality MoS2 single-crystal films. The intentionally designed sandwiched Mo source ensured a continuous, stable, and efficient supply of gas-phase Mo at high growth temperatures, preventing the formation of multilayer and randomly oriented MoS2 domains. As a result, we successfully synthesized centimeter-scale MoS2 single-crystal film in just 10 min. High-resolution scanning transmission electron microscopy (HRSTEM) characterization revealed a sulfur vacancy density of about 8.49 × 1012 cm−2, confirming the high quality of the achieved MoS2 films. The as-grown MoS2 single-crystal film was further transferred onto a 30-nm Al2O3 dielectric, and independent back-gate controlled FETs were fabricated. These FETs presented a high on–off ratio, positive VTH, high mobility, and small subthreshold swing (SS). Based on the high-performance E-mode FETs, functional logic circuits, including inverters, NAND, NOR, and AND gates, were fabricated, all with low power consumption, demonstrating their potential for low-power ICs applications.
The metal source-confined CVD (SCCVD) method (see more details in Materials and Methods) was employed to synthesize centimeter-scale MoS2 single-crystal films. Briefly, in the beginning, we fabricated an intentionally designed sandwiched Mo source, which consisted of 2 Mo foils (2 cm × 2 cm) and mixed powders containing MoO3 and NaCl (Fig. 1A), which were flattened between the 2 Mo foils. NaCl catalyst is helpful to synthesize MoS2 more effectively and avoid MoO2 by-products. The possible chemical reactions are as follows: 2MoO3 + 2NaCl⟶Na2MoO4 + MoO2Cl2 and MoO2Cl2 + 3S⟶MoS2 + SO2 + Cl2. A high-temperature pre-annealed miscut C/A sapphire substrate (2 cm × 2 cm) and the sandwiched Mo source were placed on a graphite sheet (2 cm × 6 cm), where the sapphire substrate was located at the upstream position, and the distance between them was 2 cm. Notably, the designed sandwiched Mo source has 3 advantages: (a) preventing premature nucleation; (b) ensuring appropriate reactant concentration; and (c) providing a continuous and uniform supply of reaction source. Based on previous reports [11,19], if the deposition temperature is lower than 850 °C, the MoS2 domains would be randomly arranged. In our case, evaporable MoO3 powder was confined between 2 Mo foils, effectively avoiding the premature nucleation of MoS2. Also, the slow release of the Mo can provide a more sustained supply of metal sources. In addition, the sapphire substrate was placed at the upstream position of the Mo source to avoid uneven nucleation caused by carrier gas [20]. Owing to the above design, the single-oriented MoS2 monolayers or MoS2 single-crystal films were efficiently synthesized. Notably, compared with previous reports [11,12], the growth time in our work was decreased to less than 2 min for single-oriented monolayers and 10 min for single-crystal films. As shown in Fig. 1B, we vividly compare the relationship between Mo concentration and the growth process in this work (SCCVD: red line in Fig. 1B) and previous experiments (traditional CVD: gray line in Fig. 1B; LPCVD: blue line in Fig. 1B). For the traditional CVD growth of MoS2 nanoflakes, the MoO3 or MoO2 as Mo source was placed at the center position, and the substrate was placed face down above the Mo source. In this case, when the temperature reaches the deposition temperature, the Mo source will evaporate rapidly, resulting in excessive Mo concentration. Hence, the LPCVD, which was now widely used for the growth of TMDs single-crystal films, was introduced, where the Mo source was placed in the upstream position, and O2 gas was used to promote evaporation and prevent by-products (MoO2 nanosheets), and the whole reaction was carried out at low pressure. However, owing to the ultralong distance between the Mo source and substrate (more than 30 to 40 cm in length) [17], the Mo concentration in LPCVD was too low, resulting in long growth time (30 to 60 min) and low growth rate (<0.5 cm2 min−1). Notably, in this work, the evaporable MoO3 and NaCl powders were confined by 2 Mo foils, which successfully avoided the early evaporation, the high Mo concentration, the short supply of Mo source in the traditional CVD method, and the low Mo concentration in the LPCVD method.
Figure 1C shows the photograph of the bare C/A sapphire substrate, the single-oriented MoS2 monolayers, and the MoS2 single-crystal films. It is obvious that the bare sapphire presented a translucent color, and the MoS2 single-crystal films showed a darker green color than single-oriented MoS2 monolayers due to higher coverage. Figure S1 gives the atomic force microscope (AFM) images of a pre-annealed bare sapphire substrate, demonstrating that the substrate had atomic steps. The miscut angle could be determined by the x-ray diffraction (XRD) rocking curve [11]. As shown in Fig. S2, the measured angle was 0.78°. Figure 1D shows the optical image of the as-grown MoS2 domains, which demonstrates that almost all the domains were aligned unidirectionally. Further statistical analysis presented that around 99.53% of the MoS2 domains were single-oriented (Fig. 1E). It should be noted that the MoS2 domains obtained in this study deviate from the conventional triangular or hexagonal shapes. This deviation may be attributed to 2 primary factors under our current growth conditions: firstly, the Mo and S precursor ratio may not yet be optimized; secondly, the growth rate is likely too high. Notably, we have also observed MoS2 domain morphologies resembling diamonds (Fig. S3A) and approximate triangles (Fig. S3B). Only if the deposition time was increased to 10 min could the MoS2 single-crystal films be obtained by merging the boundaries of these single-oriented MoS2 domains. Except for few 2-layer inlands, a clean, flat, and seamless MoS2 film is presented in Fig. 1F. More optical images of the obtained MoS2 films are shown in Fig. S4. Figure 1G summarizes the growth time and growth rate of single-crystal TMDs (including MoS2, WS2, and Fe-doped MoS2), indicating that, compared with previous papers, our deposition time is shorter, and our growth rate is faster [11–19]. Figure S5 compares the experimental results of placing the substrates at the upstream and downstream positions of the Mo source, confirming that our experimental design effectively prevented the uneven nucleation caused by the carrier gas flow. The AFM image (Fig. S6A) demonstrated that one edge of the MoS2 was well aligned with the atomic step of the sapphire substrate. The thickness of the MoS2 was measured as 0.8 nm (Fig. S6C), indicating the single-layer characteristic. A locally amplified AFM image (Fig. S6B and D) proved that the obtained material had a clean surface, which preliminarily evidenced its high crystalline quality. XRD was used to determine the crystal composition and structure of the MoS2 film and the sapphire substrate. As shown in Fig. 1H, the diffraction peak located at 14.35° corresponded to the (002) plane of the MoS2 film (JCPDS #37-1492). The diffraction peaks at 20.53°, 37.50°, and 41.7° (Fig. S7) consisted of (0003), (11–20), and (0006) planes of sapphire (JCPDS #46-1212), respectively.
The chemical composition, element distribution, atomic structure, and chemical valence of the single-oriented MoS2 monolayers were further investigated. As shown in Figs. S8 and S9, using a 2-step wet etching transfer method, we successfully transferred our MoS2 domains from sapphire to copper grid for STEM characterizations (see more details in Materials and Methods). Figure 2A shows the low-magnification high-angle annular dark field (HAADF) STEM image of 2 merged MoS2 domains transferred from sapphire to a copper grid with ultrathin carbon film. The single STEM energy-dispersive spectroscopy (EDS) spectra (Fig. S10) and element distribution mapping image (Mo: red dots in Fig. 2B, and S: yellow dots in Fig. 2C) determined the element composition and spatial distribution of the detected samples, confirming that the samples were MoS2. The merging behavior of the 2 MoS2 domains was further studied. HRSTEM images (Fig. 2D to F) demonstrate that the 2 MoS2 domains are seamlessly stitched together. To quantitatively evaluate the sulfur vacancy density of the MoS2 film, the samples were transferred onto a copper grid with quantifoil holey carbon (Fig. S11, without ultrathin carbon film), which could present a clear atomic structure. Figure S12A gives the HRSTEM result, and the density of sulfur vacancies was calculated as 8.49 × 1012 cm−2. Figure S12B shows the comparison results of the sulfur vacancy density in this work with previous papers [6,11,17,21–26], indicating a low defect density of the MoS2 sample. The selected area electron diffraction (SAED) patterns collected from 9 different positions of the copper grid loaded with MoS2 domains are shown in Fig. 2G. All 9 patterns presented hexagonal diffraction spots with the same crystallographic orientation (highlighted with dotted blue lines in Fig. 2G), proving that our MoS2 domains were single-oriented. Figure S13 is the corresponding line scan profiles along the dotted blue lines in Fig. 2G, further confirming the above claims. Low-energy electron diffraction (LEED) measurements were carried out at 6 distinct locations across a continuous thin-film sample (Fig. S14). The observed diffraction patterns exhibit sharp and well-defined spots, which are nearly identical in position and intensity across all measured regions. This consistency strongly indicates the single-crystal character of the film within the spliced area, confirming its structural coherence and high crystalline quality (Fig. S15). The chemical valence of the MoS2 single-crystal films was investigated by x-ray photoelectron spectroscopy (XPS). Figure S16 shows the XPS full spectrum of the tested sample, in which, except for the Al 2s, O 1s, Na 1s, and C 1s peaks from the substrate, strong Mo 3d and S 2p peaks were obtained. As shown in Fig. 2H, the binding energy peaks located at 232.9 (Mo 3d3/2) and 229.7 eV (Mo 3d5/2) resulted from the Mo oxidation state of +4. The binding energy peak at 226.9 eV (S 2s), along with the S 2p1/2 (163.8 eV) and S 2p3/2 (162.6 eV) peaks, demonstrated the existence of S2−, which was consistent with previous reports of MoS2 films (Fig. 2I) [27–29]. The Mo/S ratio was finally calculated as 1:1.8 (Table S1), confirming the formation of the MoS2 film.
The optical properties of the MoS2 single-oriented monolayers were investigated by absorption, photoluminescence (PL), Raman, and second harmonic generation (SHG) characterizations. Figure 3A shows the optical image of the samples to be measured, in which 4 separate MoS2 domains (samples 1 to 4) were selected. Figure 3D is the absorption spectra obtained from samples 1 to 4, in which 2 obvious peaks located at 1.87 and 2.02 eV were observed, corresponding to the A and B excitons of MoS2 monolayers, respectively. Figure 3E presents the PL spectra of these MoS2 monolayers. A strong PL peak located at 1.86 eV corresponded to the recombination of A excitons, and the weak peak located at 1.79 eV was from the sapphire substrate [30]. The full width at half-maximum of these spectra was as low as 0.049 eV, demonstrating the high crystal quality of our MoS2. For the Raman spectra (Fig. 3F), the E12g (380.8 cm−1, in-plane vibrational mode) and A1g (399.6 cm−1, out-of-plane vibrational mode) peaks were collected. The wavenumber difference between A1g and E12g is about 18.8 cm−1. The above results agreed well with previously reported MoS2 monolayers [6,18]. Then, the PL and Raman mapping images were measured to investigate the uniformity of the MoS2 domains. As shown in Fig. 3B, the wavelength-selected PL intensity mapping image demonstrated the uniform PL emission at 1.86 eV. Figure 3C gives the Raman mapping image (400 cm−1), further confirming the uniform formation and high quality of our MoS2 monolayers. The SHG was commonly used to characterize the orientation of the MoS2 domains. As shown in Fig. 3G, 3 merged MoS2 domains were selected. According to a previous paper [31], the SHG intensity in MoS2 monolayers follows the rule as I = I0 × cos2(2θ), where θ is the azimuthal angle between the polarization of the excitation laser and the armchair direction of MoS2 domains. Figure 3H is the polarization angle-dependent SHG intensity for the 3 MoS2 domains, which proves that the tested samples have a single orientation. Figure 3I and Fig. S17 show the SHG intensities collected from more positions of the MoS2 monolayers, in which the SHG intensities at θ of 0° were higher than 1,500 counts, and those at θ of 30° were below 100 counts, confirming that our MoS2 domains were well aligned.
Based on the successful growth of centimeter-scale MoS2 single-crystal films, the independent FETs were fabricated. The thermal release tape (TRT)-assisted wet transfer method of the MoS2 films and the fabrication process flow of the devices are presented in Figs. S8 and S18, respectively, in which atomic layer deposition (ALD)-processed 30 nm Al2O3 was employed as the oxide dielectric layer. The layout and optical images of the FETs are presented in Fig. S19. The 100 tested FETs were distributed over an area of 0.8 cm × 0.25 cm, with each device featuring a channel length of 10 μm and a channel width of 50 μm. Figure 4A shows the transfer curves at different drain voltages (VDS). With the VDS increasing, the drain current (IDS) increased correspondingly, demonstrating that the device worked well both at low (50 μV) and high (2 V) drain voltage. The on–off ratio could reach up to 108 at a VDS of 2 V, proving that the MoS2 had excellent electrical properties. Figure 4B shows the drain current–voltage (VDS–IDS) output curves. The highest IDS of the FET was up to 29 μA/μm at VDS = 5 V, confirming that the grown MoS2 film has high quality with excellent current driving capabilities. The output curves showed linear (Fig. S20A) and saturation (Fig. S20B) current at low and high bias, respectively, exhibiting the characterization of an ohmic contact. The scalability and uniformity of the MoS2 film FETs were investigated, and the corresponding results are shown in Fig. 4C and Fig. S21, in which the transfer curves of 100 FETs were displayed. A statistics histogram analysis shows that the FETs exhibited high on-state current (ION = 6.54 ± 0.82 μA/μm), low off-state current, and high on–off ratio (ION/IOFF ≈ 108) (Figs. S22 and S23). The values of the VTH (Fig. 4D) were obtained via the second derivative method (Fig. S24), which showed a positive VTH (VTH = 1.71 ± 0.32 V). Notably, the E-mode FETs, which are completely turned off at VGS = 0 V, were more favorable for constructing low-power consumption ICs than the D-mode transistors. The field-effect mobility of the transistors is a very important parameter for evaluating the current driving capability of the semiconductors, which can be calculated using the following formula: μFE = gm × L / (W × Cg × VDS), where L and W are 10 and 50 μm, respectively. The gates’ capacitance was calculated using the following formula: Cg = ε0 × εr / d, where ε0 for Al2O3 is 9.0, εr is 8.85 × 10−12 F/m, and the thickness of Al2O3 is 30 nm. As shown in Fig. 4E, the average FET mobility was thus extracted as 34.28 ± 0.46 cm2 V−1 s−1 (the gm results are shown in Fig. S25). Figure 4F shows a statistical analysis of the SS of the MoS2 FETs, which presented a relatively low SS (155.8 ± 33.7 mV dec−1). We also performed a detailed analysis of the uniformity in the electrical characteristics across the measured devices, as illustrated in Fig. S26. All the above results demonstrated that our MoS2 films were promising materials for future device applications.
Thanks to the successful fabrication of the E-mode FETs, some ICs, including the inverter, NAND, NOR, and AND circuits, were constructed. Figure S27 shows the optical images and schematics of these circuits, respectively. A series of voltage–transfer curves of the MoS2 demonstrated rail-to-rail outputs, highly sharp voltage transition (Fig. 5A), and high gain (Fig. 5B) at the supply voltage (VDD) from 0.8 to 4.5 V, where the gain reached up to 94 at a VDD of 4.5 V, which is comparable to the previous reported TMD-based inverter gates (Fig. 5C) [1,32–42]. Noise margin is a key index to evaluate the performance of metal-oxide-semiconductor inverters, which is defined as (NML + NMH)/VDD, where NML (NML = VIL − VOL) and NMH (NMH = VOH − VIH) are the low- and high-level noise margins, respectively. Figure 5D gives the voltage–transfer curve and its mirror reflection of the MoS2 inverter at a VDD of 1.2 V, which was used for extracting the NML and NMH. The calculated value of the noise margin reached up to 82%, which confirmed that the MoS2 inverters had high noise tolerance. The power consumption of these devices, defined as P = VDD × IDD, where P is power consumption, and IDD is supply current, is shown in Fig. 5E. The maximum power consumption was less than 0.3 nW at a VDD of 0.8 V, which was attributed to the high-quality n-type MoS2 channel materials. As shown in Fig. 5F, our results exhibited lower power consumption compared with previously reported papers [1,33,34,36,38]. Table S2 gives the detailed performance comparison of devices in the references and this work. The other basic logic circuits based on the high-performance MoS2 inverters were fabricated. Figure 5G to I shows the output performance of the logic NAND (Fig. 5G), NOR (Fig. 5H), and AND (Fig. 5I) circuits. In our tests, VIN A and VIN B were the input signals, and we inputted signals (0, 0), (0, 1), (1, 0), and (1, 1), each lasting 40 s; “0” and “1” are 0 and 5 V, respectively. All the logic circuits were tested 5 times and showed rail-to-rail outputs with excellent stability. Table S3 gives the corresponding truth table. The output waveforms of these circuits are presented in Fig. S28, demonstrating well-behaved operations.
In summary, the centimeter-scale MoS2 single-crystal films were successfully synthesized, using a well-designed sandwiched Mo source, reducing the growth time to just 10 min. The sulfur vacancy defect density in the MoS2 film was measured to be 8.49 × 1012 cm−2. The designed MoS2 FETs exhibited high on-state current (6.54 ± 0.82 μA/μm at VDS = 1 V), low off-state current, high on–off ratio (>108), positive VTH (1.71 ± 0.32 V), high mobility (34.28 ± 0.46 cm2 V−1 s−1), and low SS (155.8 ± 33.7 mV dec−1). Inverter gates based on the high-performance E-mode MoS2 FETs showed high gain, high noise margins, and low power consumption. Furthermore, logic circuits including NAND, NOR, and AND gates were fabricated and exhibited rail-to-rail outputs. Our results not only provide an effective approach for growing MoS2 films with ultrashort growth times but also demonstrate a great application for future ICs.
Before synthesis, a C/A miscut sapphire (diameter: 4 inches) was annealed at 1,040 °C for 4 h. The annealed sapphire was cut into 2-cm squares and cleaned in isopropyl alcohol, acetone, and deionized water to remove surface impurities, respectively. MoO3 (0.5 g, 99.99%) and NaCl (0.05 g, 99.9%) powders were mixed and evenly placed on the top surface of a Mo foil (99.95%, 0.025 mm thick, 2 cm × 2 cm). Another Mo foil with the same specification was placed on top of the above-mentioned Mo foil. After that, the Mo foil/MoO3 + NaCl/Mo foil sandwich metal source was prepared.
The MoS2 samples were synthesized by using a one-zone tube furnace (HF-Kejing, OTF-1200F-X, diameter: 2 inches). A ceramic crucible containing sublimed sulfur powder (10 g, 99%) loaded into a 2-inch CVD chamber was placed 14 cm upstream from the center. As shown in Fig. 1A, a rectangular graphite boat (2 cm × 6 cm) with the sapphire substrate and the sandwiched Mo source was placed in the chamber’s center. The sapphire substrate was placed at the head position of the graphite boat, and the distance between the sapphire substrate and the Mo source was controlled at 2 cm. High-purity argon (Ar) from upstream to downstream was used as carrier gas. The gas flow was first set as 1,200 standard cubic centimeters per minute (SCCM) for 10 min before heating for cleaning the chamber, and then set as 75 SCCM for the growth of the MoS2 at atmospheric pressure. The furnace was heated to 930 °C within 30 min. The growth was performed for less than 2 min to obtain single-oriented MoS2 monolayers, and for 10 min to obtain the centimeter-scale (2 cm × 2 cm) MoS2 films. Finally, the furnace was cooled to room temperature automatically.
Polymethyl methacrylate (PMMA, 950K, 4A) was spin-coated on the MoS2/sapphire substrate at 4,000 rpm and baked at 180 °C for 90 s. A TRT (2 cm × 2 cm) was pasted on PMMA/MoS2/sapphire and soaked in 10% KOH for 5 min. The TRT/PMMA/MoS2 was peeled off from the sapphire and transferred onto the target substrate, and baked at 120 °C to release the TRT. PMMA was removed by acetone (Fig. S8). The MoS2 monolayer was prepared for TEM analysis using a 2-step transfer process. The first step involved transferring the MoS2 monolayer from the original sapphire substrate onto a SiO2/Si (100) substrate and only releasing the TRT film, as described above. Then, the SiO2/Si substrate with the PMMA/MoS2 film was cut into small square pieces measuring about 3 mm. The sample was immersed in a 10% KOH solution for 2 h to wet-etch the SiO2 layer, allowing the PMMA/MoS2 film to detach and float on the surface. The PMMA/MoS2 film was washed 3 times with deionized water and then scooped up with a copper grid. After drying, PMMA is removed with acetone (Fig. S9).
The morphologies of all samples were characterized by optical microscopy (Zeiss Axio Scope A1), AFM (Bruker Multimode 8), and STEM (FEI Themis Z 3.2 operated at 300 KV). PL and Raman measurements were performed by a confocal microscope (WITec, alpha-300) with a 532-nm diode continuous-wave laser as the excitation. Absorption spectra were obtained by a modified Olympus microscope system, and a tungsten lamp (Zeiss HAL 100) was used as the light source. The light source was focused by an objective lens (50×, Zeiss, 0.75NA). The absorbance (A) was calculated as A = 1 – I0/I, where I and I0 are the light intensities transmitted through the quartz substrate on and off the samples, respectively. The SHG experiments were performed in the Olympus microscope system. A 1,030-nm pulse laser (80 MHz repetition rate) was focused by the objective lens (50×, Zeiss, 0.75 NA), and the SHG signal was collected by the same objective. A650 short-pass dichroic mirror was applied to filter the excitation laser.
For the device fabrication, the back gate 10 nm Bi/20 nm Au metal array was fabricated on a bare 300-nm SiO2/Si wafer by using lithography and thermal evaporation. Then, a 30-nm Al2O3 dielectric layer was deposited by using ALD and patterned by using lithography and inductively coupled plasma reactive ion etching (ICP-RIE). After that, the MoS2 film on the Al2O3 substrate was transferred onto the target substrate using the wet transfer method. The MoS2 film on the new substrate was patterned by using lithography and ICP-RIE. Finally, the source and drain 10- to 15-nm Bi/50 nm Au metal array was fabricated by using lithography and thermal evaporation. The electrical properties of the FETs and logic circuits of the MoS2 films were measured in vacuum (∼10−5 Pa) with a Lake Shore Probe Station and an Agilent B1500A semiconductor analyzer at room temperature.
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Year 2026 volume 9 Issue 1
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doi: 10.34133/research.1117
  • Receive Date:2025-10-01
  • Online Date:2026-10-16
  • Published:2026-01-20
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  • Received:2025-10-01
  • Revised:2026-01-06
  • Accepted:2026-01-07
Affiliations
    1Hunan Institute of Optoelectronic Integration, State Key Laboratory of Advanced Design and Manufacturing Technology for Vehicle, College of Materials Science and Engineering, Hunan University, Changsha 410082, China.
    2College of Advanced Interdisciplinary Studies & Hunan Provincial Key Laboratory of Novel Nano-Optoelectronic Information Materials and Devices, National University of Defense Technology, Changsha 410073, China.
    3School of Physics and Electronics, Hunan Normal University, Changsha 410081, China.

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* Address correspondence to: (L.X.);
* Address correspondence to: (D.L.);
* Address correspondence to: (A.P.)
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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