Research on the flexible hybrid epidermal electronic system (FHEES) has attracted considerable attention due to its potential applications in human–machine interaction and healthcare. Through material and structural innovations, FHEES combines the advantages of traditional stiff electronic devices and flexible electronic technology, enabling it to be worn conformally on the skin while retaining complex system functionality. FHEESs use multimodal sensing to enhance the identification accuracy of the wearer's motion modes, intentions, or health status, thus realizing more comprehensive physiological signal acquisition. However, the heterogeneous integration of soft and stiff components makes balancing comfort and performance in designing and implementing multimodal FHEESs challenging. Herein, multimodal FHEESs are first introduced in 2 types based on their different system structure: all-in-one and assembled, reflecting totally different heterogeneous integration strategies. Characteristics and the key design issues (such as interconnect design, interface strategy, substrate selection, etc.) of the 2 multimodal FHEESs are emphasized. Besides, the applications and advantages of the 2 multimodal FHEESs in recent research have been presented, with a focus on the control and medical fields. Finally, the prospects and challenges of the multimodal FHEES are discussed.
| 1. | Delamination. The heterogeneous integration of flexible devices and rigid components in all-in-one multimodal FHEESs results in a mismatch in mechanical properties, leading to delamination and significantly reducing the reliability of all-in-one multimodal FHEESs. |
| 2. | Skin conformality. The incorporation of rigid components within the design of all-in-one multimodal FHEESs presents a challenge in achieving conformal adhesion with the skin, which is essential for the acquisition of high-quality signals. This is due to the limited stretchability and thinness of the skin, which are incompatible with the stiffness of the devices. |
| 3. | Energy source. Achieving high-efficiency wireless power or self-power sources within the all-in-one FHEESs will greatly reduce the mass and volume, thereby improving comfort and application scopes. |
| 4. | Permeability. The stacked structure of all-in-one FHEESs impedes the skin's breathing and prevents the system from being used for a long time. Therefore, it is meaningful to develop porous/permeable all-in-one multimodal FHEESs. |
| 5. | Data transmission. Signal wireless transmission is a significant source of power consumption, particularly in multimodal sensing and real-time monitoring applications. Local processing can further enhance the operation lifespan of the system. |
| 6. | Manufacturing process. The integrated manufacturing of soft and rigid devices presents unique challenges with no efficient and universal manufacturing process reported. Existing all-in-one FHEESs rely on manual operation in the laboratory, limiting their scalability and utility. |
| 1. | Soft–stiff interfaces. The key to forming the functional system of assembled FHEESs is the realization of soft–stiff interfaces. However, the research on soft–stiff interfaces is still in its infancy. A reliable soft–stiff interface that can complete the assembly of soft and stiff modules at any time and in any location should possess the following characteristics: a stable electrical connection can be formed with both soft and stiff modules, universality, stretchability, low cost, and a simple manufacturing process. |
| 2. | Stability. Stability is an important issue for assembled multimodal FHEESs due to the flexibility of soft modules and differences in users' skin. Further research is required to develop effective packaging strategies, encapsulation materials, and calibration techniques that remain to be further explored. |
| 3. | Selectivity. Selectivity is a major concern for mechanical sensing and electrochemical analysis. For example, pressure and strain can interfere with each other, and temperature can affect the sensor's response to biomarkers in sweat. Potential solutions may involve the customization of the soft module structure for the specific application scenario and the assistance of calibration hardware or software. |
| 4. | Recyclability. Soft modules in assembled multimodal FHEESs are typically disposable, necessitating the development of recycling technology for soft modules in FHEESs to reduce resource consumption and manufacturing costs. |
| 1. | Biomimetic multimodal epidermal electronic system. The structure of living organisms often possesses multimodal characteristics, and imitating their construction and integration methods can help achieve a more comprehensive epidermal electronic system. For example, a 3D electronic skin inspired by the spatial distribution of receptors in the skin exhibits excellent mechanical decoupling performance, which can measure pressure, shear force, and strain at the same time. This electronic skin can perceive the curvature and modulus of objects through touch [145]. |
| 2. | Implementing the human–machine fusion system by soft–stiff interface technology. Integrating electronic devices with the human body through skin films is expected to achieve a new paradigm of enhancing human functions, daily health management, and human–machine collaboration. At present, the operation of flexible thin-film electronic components still requires the coordination of traditional stiff electronic components. There is an urgent need to solve the problem of connecting the on-skin components to devices outside the skin. As mentioned above, a plug-and-play interface can be realized by adjusting the density of gold nanoparticles deposited on an adhesive substrate, which achieves stable, conductive, stretchable, and self-adhesive connections between different components (soft and soft, soft and stiff) [29]. However, the research on developing soft and stiff skin interfaces with lower costs, suitable for different substrates and stable skin adhesion, is still in its early stages. |
| 3. | Conductor and semiconductor elastic materials innovation. The development from hybrid electronic systems to fully flexible electronic systems will inevitably replace existing silicon-based chips and printed circuit boards. Finding elastic conductor materials and semiconductor materials with good performance is the foundation for constructing flexible digital gate devices or analog devices. Based on stretchable organic and nanomaterials, intrinsically stretchable diodes capable of operating at a frequency as high as 13.56 MHz have been presented [146]. An e-skin system without rigid electronic components achieves multimodal perception, neuromorphic pulse-train signal generation, and closed-loop actuation. This is because they adopted intrinsic elastic conductors and semiconductor materials, and made unique innovations in the engineering of material properties [147]. |
| 4. | Innovation and integration of manufacturing processes. There have been many studies on the manufacturing process of hybrid epidermal electronic systems, and some typical processes such as inkjet printing and laser engraving can quickly form flexible electronic components, but the integration process of how flexible electronic devices and traditional electronic devices are assembled to form hybrid electronic systems is not mature. This issue is mainly reflected in many all-in-one FHEES studies where the manual placement of stiff components is still used to assemble their hybrid electronic systems [28,83]. In terms of innovation, 3D manufacturing and manufacturing on the curved surface have attracted a lot of attention. Take the representative of 3D manufacturing technology, 3D printing, as an example; its progress is reflected in incorporating more diverse materials into the machinability range, such as hydrogel and conductive composites [69,148] and more precise control [149]. Besides, for manufacturing on 3D surface, transfer printing, self-assembly, direct writing, and other methods enable the processing of flexible electronic devices on curved surfaces and obtain conformal electronic devices applied to body surfaces [150–152]. Currently, there are still a lot of issues to be explored in terms of consistency between planar and curved shapes, the range of materials that can be manufactured, component adhesion on curved surfaces, etc. |
| 5. | Innovation and application of self-power technology. Self-power technology will help epidermal electronic systems achieve long-term operation, broadening their working space. For example, to continuously collect multimodal physicochemical data across indoor and outdoor physical activities for over 12 hours, a hybrid electronic wearable system adopts perovskite solar cells to collect energy from the surrounding light [80]. However, due to the dependence on environmental energy, all existing self-power methods have application limitations. Hybrid energy supply solutions are promising in the future. |
| 6. | Collaboration with machine learning/artificial intelligence. Multimodal hybrid flexible electronic systems will bring numerous physiological data around the clock. To save manpower and improve real-time performance, the denoising and analysis of these data require the cooperation of artificial intelligence (the development trend from cloud to edge), which has become a consensus [25,153]. |
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |