Mechanical strength and stability are the main factors to be considered in the application of barcode beads, especially in cell culture and capture. The highly color visible C@SiO
2 PC beads are converted by pyrolysis of coating PDA, which plays a role as an adhesive polymer and increases the PC beads’ binding strength. As expected, the mechanical properties, i.e., compression resistance and ultrasonic damage resistance, increased upon PDA to C conversion. The compression tests were implemented by NanoTest, which were to test the load stresses of beads to reach 25
μm depths (Figures S5-S8). Figure
3(a) shows the resulted curves of load vs. depth for SiO
2 PC beads, PDA@SiO
2 PC beads, sintered SiO
2 PC beads, and C@SiO
2 PC beads. The PDA@SiO
2 PC beads endured nearly
stresses before breaking, which were double of the SiO
2 PC beads. After pyrolysis, the endured pressure increased, with values of
for C@SiO
2 PC beads and
for sintered SiO
2 PC beads. Furthermore, the residual rate after suffering two minutes of ultrasonic treatment increased after pyrolysis. As shown in Figure
3(b), the average residual rate was calculated to be 0.12 for SiO
2 PC beads, 0.48 for PDA@SiO
2 PC beads, 0.59 for sintered SiO
2 PC beads, and 0.95 for C@SiO
2 PC beads. As a result, compared to the initial SiO
2 PC beads, the C@SiO
2 PC beads exhibited remarkably increased compression resistance (365%) and ultrasonic damage resistance (792%). In order to understand the reasons for the increase of mechanical strength for C@SiO
2 PC beads, the section-cross of the above beads were investigated by the field emission scanning electron microscopy (FESEM), as shown in Figures
3(c) and S9. Except for SiO
2 PC beads, many grains were observed between the particles of PDA@SiO
2 PC beads, sintered SiO
2 PC beads, and C@SiO
2 PC beads. Raman spectra of SiO
2 PC beads, PDA@SiO
2 PC beads, and C@SiO
2 PC beads confirmed that the grains of PDA@SiO
2 PC beads could be contributed to a self-adhesion reaction of PDA shells, the grains for sintered SiO
2 PC beads might be the fusion of SiO
2 particles by pyrolysis, and the grains for C@SiO
2 PC beads may be due to the pyrolysis of PDA shells (Figure S10). Regardless of the fact that grains existed in all these PC beads, C@SiO
2 PC beads own the strongest mechanical strength. This may be attributed to the graphitic structure which was formed by pyrolysis of PDA, which is more stable than that of the PDA supermolecule and even stronger than the silicon-oxygen bond between the sintered SiO
2 PC beads. XPS was further used to analyze the chemical composition and confirm this speculation. The peaks at 284.8, 401.1, and 532.1 eV correspond to C1s, N1s, and O1s in the PDA@SiO
2 beads and C@SiO
2 beads (Figure S11), respectively. After pyrolysis, a significant decrease in the N1s and O1s peaks was observed due to chemical reduction and graphitization [
33]. High-resolution N1s and C1s spectra from the C@SiO
2 beads revealed significant differences in the carbon chemistry of the PDA. The high-resolution N1s spectra indicated the presence of graphitic N at 400.9 eV, pyrrolic N at 399.0 eV, and pyridinic N at 398.4 eV (Figures
3(d) and
3(e)). The major N1s peak observed in the PDA@SiO
2 beads corresponded to pyrrolic N (57.55%), whereas the N1s peak observed in the C@SiO
2 beads corresponded to graphitic N (82.77%). The high-resolution C1s spectra exhibited similar shifts after pyrolysis. The high-resolution C1s spectra indicated the presence of C-H bonding at 281.3 eV, C-C bonding at 284.5 eV, C-O bonding at 285.5 eV, C-N sp
2 bonding at 286.1 eV, C-O-C bonding at 286.8 eV, and C-N sp
3 bonding at 288.2 eV (Figure S12). The C-H level decreased significantly after pyrolysis, from 15.58% (PDA@SiO
2) to 3.17% (C@SiO
2). Moreover, the level of C-O bonding increased from 2.26% (PDA@SiO
2) to 32.68% (C@SiO
2). As a result, the strong graphitic interaction and additional interaction area induced by template pyrolysis PDA endow the C@SiO
2 PC beads with a strong mechanical strength, which brings great convenience to the real application of PC barcode beads.