First, we fabricated an h-BN-encapsulated MoS
2 synaptic transistor on an AlO
x/Si substrate, which simulates synaptic behavior by photoelectric stimulation, as shown in Figures
1(a) and
1(b). 2D layered h-BN and MoS
2 were prepared by mechanical exfoliating. The surface morphology of our device was characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM), as shown in Figure
1(c) and Figure S2a, respectively, showing a typical channel width of 10
μm, a length of 15
μm, and the thickness of the MoS
2; h-BN was approximately 1.7 and 7 nm. The Raman spectrum shows the characteristic peaks of both materials: Raman shift of the MoS
2 characteristic peak is 385,405 cm
-1 (Figure
1(e)) and the h-BN is 1366 cm
-1 (Figure S2b), which is consistent with previous reports. Figure
1(d) shows the Raman mapping of h-BN-encapsulated MoS
2 synaptic transistor at 405 cm
-1, the channel MoS
2 exhibits intense intensity, and the h-BN/MoS
2 overlap region is more strongly correlated with h-BN encapsulation, where the black and gray dashed areas represent the h-BN/MoS
2 overlap region and channel MoS
2, respectively. A significant peak was observed in the PL spectrum of MoS
2 at 1.88 eV photon energy (Figure
1(f)), which is consistent with the band gap of multilayer MoS
2. Then, we studied the behavioral characteristics of our h-BN-encapsulated MoS
2 synaptic transistor under electrical modulation. Figure
2(a) shows the
ds-
bg curves of the h-BN-encapsulated MoS
2 synaptic transistor with
ds of 0.1, 0.5, and 1 V. The back gate voltage was swept from -6 to 8 V, then swept back, and a noticeable clockwise hysteresis loop was observed, which may be due to charge trapping between the MoS
2 and AlO
x interfaces. The statistical distribution of the maximum value of the memory window indicates that the memory window of most devices is 2~3 V (see the statistics of 80 devices in Figure S11a in Supplementary Materials). The transfer curves of the h-BN/MoS
2/h-BN control devices show no hysteresis window, since the bottom h-BN isolates the interface effect of MoS
2 and AlO
x (see Figures S10a-c, the schematic diagram of the control devices, micrograph of the control device, and transfer curves of the control devices in Supplementary Materials). Owing to top encapsulated h-BN, the stability of our devices has been significantly improved (see Figure S3, output curves and stability of h-BN-encapsulated MoS
2 synaptic transistor in Supplementary Materials) [
52–
55]. We explored the optimal base and pulse voltages for device operation in electrical mode for excitatory and inhibitory synapses, with reference to gain (
5/
1, the amplitude of the postsynaptic current caused by spike is denoted by
) of five consecutive pulses and long-term synaptic weight changes (
ΔW/W, calculated by
, where
0 and
represent the current states before and after the application of the pulse signal, respectively. Before applying the pulse signal, we select the average value at the 5th second as
0. After the pulse signal is applied, the average value of the 40th second is selected as
, and the pulse signals are applied at the same time. For excitatory synapses, the gain was maximized when
bg base was -3 V and pulse was -4 V (pulse duration of 10 ms, interval of 200 ms), as shown in Figure
2(b) (no synaptic excitability of the h-BN/MoS
2/h-BN control devices under the same
bg base and pulse conditions, see Figure S10d in Supplementary Materials). For inhibitory synapses, excitatory spike stimulation was first performed, and then fixed base, incremental
bg pulse was applied, and gain and weight changes were reduced, that is, the depression effect gradually strengthened, and 8 V was selected as the inhibitory spike (duration of 10 ms, interval of 200 ms), as shown in Figure
2(c) (no synaptic inhibition of the h-BN/MoS
2/h-BN control devices under the same
bg base and pulse conditions, see Figure S10e in Supplementary Materials). Figure
2(d) shows the frequency plasticity of inhibitory synapses with fixed duration of 10 ms and number of 10, and the gain gradually decreases as the frequency increases. Figure
2(e) depicts postsynaptic current characteristics under 30 cumulative excitatory and inhibitory spiking stimulations (duration of 10 ms, interval of 200 ms), which exhibits long-term potentiation and inhibition under electrical mode (the h-BN/MoS
2/h-BN control devices have no LTP and LTD characteristics under the same
bg base and pulse, see Figure S10f in Supplementary Materials). Furthermore, Figure
2(f) shows extracted PSC from excitatory and inhibitory spikes, where electrical potentiation and inhibition are clearly observed. The number-dependent facilitation and depression under electrical stimulation are shown in Figure S4 in Supplementary Materials. The electrical potentiation and inhibition effects under electrical stimulation are attributed to the charges trapping and detrapping at the MoS
2-AlO
x interfaces. The statistical distribution of the maximum value of the excitatory index indicates that the excitatory index of most devices can reach 500-700% (see the statistics of 80 devices in Figure S11b in Supplementary Materials). Under forward bias (
bg pulse of 8 V), the oxygen vacancy trapping states in AlO
x move toward the channel, trapping the electrons in MoS
2, causing channel current to decrease, corresponding to synaptic inhibition. While under reverse bias (
bg pulse of -4 V), oxygen ions in AlO
x move toward MoS
2, and the oxygen vacancy trapping states release trapped electrons, resulting in increased channel current, which corresponds to synaptic potentiation (see Figure S5, physical mechanism under electrical stimulation in Supplementary Materials).