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Review on Mission Profiling for New Energy Vehicle Chips
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Yuli Wu1, Xin Zhou1, Haitao Jiang1, Jie Chen1, Xiaolei Lu2
Automotive Digest | 2026, (9) : 1 - 12
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Automotive Digest | 2026, (9): 1-12
• Special Topic on Automotive Chip Technology •
Review on Mission Profiling for New Energy Vehicle Chips
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Yuli Wu1, Xin Zhou1, Haitao Jiang1, Jie Chen1, Xiaolei Lu2
Affiliations
  • 1.China Automotive Engineering Research Institute (Jiangsu) Co., Ltd., Suzhou 215010
  • 2.China Automotive Engineering Society, Beijing 102600
Published: 2026-09-05 doi: 10.19822/j.cnki.1671-6329.20260044
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To address the adaptability bottlenecks of traditional automotive-grade chip mission profile frameworks in the context of high-voltage electrification and the large-scale deployment of wide-bandgap devices in new energy vehicles, this paper conducts a systematic review of the theoretical framework, standardization paradigms, load parameter discrepancies, reliability assessment models, and engineering application boundaries of automotive chip mission profiles, based on AEC-Q100 Rev-J. The fundamental differences in chip loading characteristics between conventional fuel vehicles and new energy vehicles are comparatively analyzed across multiple dimensions. The study reveals that the thermal load duration of chips in new energy vehicles is approximately 10 times longer than that in fuel vehicles, with operating voltages reaching 800 V and power device switching frequencies increasing by approximately 20 times. Traditional automotive chip reliability assessments are inadequate for new energy vehicles, failing to address multi-physics coupling, long-term aging, and the unique failure mechanisms of wide-bandgap devices. Currently, the reliability certification of automotive-grade chips is shifting from "general compliance demonstration" to "application suitability demonstration". In the future, constructing refined, dynamic, and multi-scale mission profiles, along with improving the suitability assessment system for wide-bandgap devices, will become critical directions requiring breakthrough in this field.

New energy vehicles  /  Automotive-grade chips  /  Mission profile  /  Reliability assessment  /  Multi-physics coupling  /  Wide bandgap semiconductors
吴宇立, 周昕, 姜海滔, 陈杰, 陆晓磊. 新能源汽车芯片任务剖面综述. 汽车文摘, 2026 , (9) : 1 -12 . DOI: 10.19822/j.cnki.1671-6329.20260044
Yuli Wu, Xin Zhou, Haitao Jiang, Jie Chen, Xiaolei Lu. Review on Mission Profiling for New Energy Vehicle Chips[J]. Automotive Digest, 2026 , (9) : 1 -12 . DOI: 10.19822/j.cnki.1671-6329.20260044
Year 2026 volume Issue 9
212
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doi: 10.19822/j.cnki.1671-6329.20260044
  • Online Date:2026-09-23
  • Published:2026-09-05
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    1.China Automotive Engineering Research Institute (Jiangsu) Co., Ltd., Suzhou 215010
    2.China Automotive Engineering Society, Beijing 102600
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表12种不同金属材料的力学参数
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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