To address signal crosstalk and reflection phenomena caused by the wiring layout of automotive Printed Circuit Boards (PCBs), a simulation software Cadence is utilized to model the reflection phenomena of high-speed signal lines. The causes of signal reflection are analyzed, and impedance matching schemes for reflection are employed in the termination design. The effects of 4 different types of terminations, namely series termination, Thevenin termination, RC termination, and diode termination, on the signal quality in transmission lines are compared. Additionally, enhancements are made to power integrity through optimized power plane design, which significantly enhances the Electromagnetic Compatibility (EMC) performance of the PCB. The study demonstrates that signal integrity, power integrity, and electromagnetic interference are interrelated and mutually constraining. Conducting reliability designs for these 3 aspects by combining stimulation data can significantly improve the EMC performance of PCBs.