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Research on the Development Trend of Automotive AI Chips
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Yang Liu, Qiang Wang, Rui Bao, Wenchao Mei, Kai Zhang
Automotive Digest | 2026, (9) : 13 - 21
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Automotive Digest | 2026, (9): 13-21
• Special Topic on Automotive Chip Technology •
Research on the Development Trend of Automotive AI Chips
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Yang Liu, Qiang Wang, Rui Bao, Wenchao Mei, Kai Zhang
Affiliations
  • Global R&D Center, China FAW Corporation Limited, Changchun 130013
Published: 2026-09-05 doi: 10.19822/j.cnki.1671-6329.20240293
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To clarify the current state of the automotive AI chip industry, address technological pain points, and identify the future development trends of the industry, while supporting the domestic automotive AI chip industry's independent and high-quality development, this focuses on the core application scenarios of AI chips in intelligent connected vehicles, such as smart driving perception, decision-making, control, and smart cockpit interaction. It systematically reviews the core requirements of intelligent connected vehicles for AI chips, including high computing power, low power consumption, high security, and high reliability. At the same time, it analyzes the technology layouts and product iterations of mainstream domestic and international automotive AI chip companies like Qualcomm, NVIDIA, Tesla, Horizon, and SiEngine Technology, and, based on the current industry situation, summarizes the main technical bottlenecks and solutions for automotive AI chips in areas like memory bandwidth and packaging processes. On this basis, it assesses the future development trends of automotive AI chips in terms of domain fusion, heterogeneous architecture integration, computing power growth, the implementation of computing-storage integration technology, and advanced packaging. The goal is to provide a reference and inspiration for the technological research and development, product iteration, industrial layout and relevant research of vehicle-mounted AI chips.

Automotive AI chips  /  Domain fusion  /  Computing-In-Memory (CIM)  /  Chip computing power  /  Advanced packaging
刘洋, 王强, 鲍瑞, 梅文超, 张凯. 汽车AI芯片发展趋势研究. 汽车文摘, 2026 , (9) : 13 -21 . DOI: 10.19822/j.cnki.1671-6329.20240293
Yang Liu, Qiang Wang, Rui Bao, Wenchao Mei, Kai Zhang. Research on the Development Trend of Automotive AI Chips[J]. Automotive Digest, 2026 , (9) : 13 -21 . DOI: 10.19822/j.cnki.1671-6329.20240293
Year 2026 volume Issue 9
198
53
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doi: 10.19822/j.cnki.1671-6329.20240293
  • Online Date:2026-09-23
  • Published:2026-09-05
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    Global R&D Center, China FAW Corporation Limited, Changchun 130013
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表12种不同金属材料的力学参数
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Family
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Number of
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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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