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Research on Accelerated Aging Models for Reliability Testing of Automotive-Grade Chips
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Yan Yin1, Xin Zhou1, Jinglu Zhang1, Jie Chen1, Xiaolei Lu2
Automobile Technology | 2026, (6) : 38 - 44
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Automobile Technology | 2026, (6): 38-44
• Selected Academic Papers of the 28th CAST Annual Meeting •
Research on Accelerated Aging Models for Reliability Testing of Automotive-Grade Chips
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Yan Yin1, Xin Zhou1, Jinglu Zhang1, Jie Chen1, Xiaolei Lu2
Affiliations
  • 1.China Automotive Engineering Research Institute (Jiangsu) Co., Ltd., Jiangsu 215010
  • 2.China Automotive Engineering Society, Beijing 100000
Published: 2026-06-24 doi: 10.19620/j.cnki.1000-3703.20260112
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As core components of automotive electronic systems, the reliability of automotive-grade chips directly determines vehicle safety and service life. Traditional accelerated aging models are primarily designed for conventional industrial and consumer electronics testing scenarios and do not fully account for the complex and variable operating conditions found in automotive applications. Consequently, reliability verification of automotive-grade chips suffers from issues such as low accuracy in life prediction, poor alignment with failure mechanisms, and significant deviations in test results. Based on the AEC-Q100 automotive standard, this paper systematically reviews the typical failure mechanisms of automotive-grade chips, classic accelerated aging models, and automotive application scenarios. It analyzes future trends in aging model development to provide theoretical support and engineering references for the reliability assessment, test plan design, and product optimization of automotive-grade chips.

Automotive-grade chips  /  Reliability testing  /  Accelerated aging model  /  AEC-Q100  /  Multi-stress coupling  /  Failure mechanism
尹研, 周昕, 张晶露, 陈杰, 陆晓磊. 车规级芯片可靠性测试加速老化模型研究. 汽车技术, 2026 , (6) : 38 -44 . DOI: 10.19620/j.cnki.1000-3703.20260112
Yan Yin, Xin Zhou, Jinglu Zhang, Jie Chen, Xiaolei Lu. Research on Accelerated Aging Models for Reliability Testing of Automotive-Grade Chips[J]. Automobile Technology, 2026 , (6) : 38 -44 . DOI: 10.19620/j.cnki.1000-3703.20260112
Year 2026 volume Issue 6
176
35
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doi: 10.19620/j.cnki.1000-3703.20260112
  • Online Date:2026-09-23
  • Published:2026-06-24
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  • Revised:2026-04-17
Affiliations
    1.China Automotive Engineering Research Institute (Jiangsu) Co., Ltd., Jiangsu 215010
    2.China Automotive Engineering Society, Beijing 100000
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多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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