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The Patent Layout Analysis of Automotive Hot Stamping Dies
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Fang Huang1, Jiaxuan Li2
Automobile Technology & Material | 2024, (12) : 27 - 33
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Automobile Technology & Material | 2024, (12): 27-33
The Patent Layout Analysis of Automotive Hot Stamping Dies
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Fang Huang1, Jiaxuan Li2
Affiliations
  • 1 Tianjin University, Tianjin 300350
  • 2 Dalian Maritime University, Dalian 116026
Published: 2024-12-20 doi: 10.19710/J.cnki.1003-8817.20230281
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Using patent analysis methods, this paper analyzes the patent layout of automotive hot stamping dies from the perspectives of patent application trends, regional distribution, and applicants, and taking automotive B-pillar hot stamping dies and automotive longitudinal beam hot stamping dies as examples to interprets important patent technical solutions. From a patent perspective, this paper analyzes the development status of automotive hot stamping die technology from both macro and micro perspectives, and provides reference for subsequent research, development and innovation directions in the field of automotive hot stamping die technology.

Automotive hot stamping  /  Did  /  Patent analysis
Fang Huang, Jiaxuan Li. The Patent Layout Analysis of Automotive Hot Stamping Dies[J]. Automobile Technology & Material, 2024 , (12) : 27 -33 . DOI: 10.19710/J.cnki.1003-8817.20230281
Year 2024 volume Issue 12
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doi: 10.19710/J.cnki.1003-8817.20230281
  • Online Date:2025-11-26
  • Published:2024-12-20
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    1 Tianjin University, Tianjin 300350
    2 Dalian Maritime University, Dalian 116026
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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