To enhance the performance and reliability of power modules, the paper addresses inherent electro-thermal-mechanical multi-physics coupling characteristics. Utilizing Finite Element Analysis (FEA), comprehensive multi-physics simulations are conducted employing ANSYS software tools, including Q3D Extractor, Fluent, Maxwell, and Twin Builder. The simulation results demonstrate that parasitic inductance and thermal resistance significantly impact the switching characteristics and thermal management performance of the power modules. A thorough system-level evaluation is performed through thermal simulation, parasitic parameter extraction, and Double-Pulse Testing (DPT) simulations. Furthermore, the simulation accuracy is significantly improved by implementing an iterative verification process where experimental measurements are used to recalibrate the simulation models. This refined methodology provides a valuable reference for the subsequent optimization of power module design.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |