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As a critical step in flexible electronics packaging, the ultra-thin chip peeling process plays a vital role in ensuring high-yield manufacturing. This study focused on mechanical behavior differences between two peeling methods: roller-stretching and needle-ejecting. A theoretical model of the "chip-adhesive-substrate" laminated structure was established and validated by finite element simulation. A dual-criteria safety criterion was proposed to quantify process safety based on the competing relationship between interfacial fracture energy of the adhesive layer and surface cracking stress of the chip layer, which overcame the limitations of traditional methods for quantitatively evaluating the safety of the peeling process. Results demonstrated that the needle-ejecting procedure outperforms roller-stretching in terms of the safety of ultra-thin chip peeling. The roller-stretching process only has high engineering application prospect for peeling large-sized and thick chips from soft and thick substrates. Furthermore, an innovative stretching-ejecting combination technology is proposed, introducing the concept of synergistic matching to achieve chip stress neutralization and fracture mode optimization. This research provides theoretical insights into non-destructive ultra-thin chip peeling technology, and delivers practical guidance for advancing high-yield flexible microelectronics packaging.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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