Full
Outline
To address the issue of insufficient heat transfer efficiency in traditional heat sinks caused by increasing chip power density，a novel chip heat sink based on the synergistic effect of metal foam and porous ribs is proposed.Through numerical simulation，a 3D composite structure was constructed （using metal foam as the background area and porous ribs as discrete arrays in hotspot areas），with peak temperature，temperature difference，pressure drop，and equivalent thermal resistance as evaluation indicators，comparing the performance of the new heat sink with traditional metal foam heat sinks and porous rib heat sinks.The results show that under the conditions of coolant inlet flow velocity of 0.1~0.4 m/s and porosity of 0.8，the new heat sink has the lowest peak temperature （36 ℃，2 ℃ lower than the metal foam heat sink and 1 ℃ lower than the porous rib heat sink），the smallest temperature difference （3 ℃，1 ℃ and 4 ℃ lower than the former two respectively），and the lowest equivalent thermal resistance （1.3 K/W，7.1% and 10.3% lower than the former two respectively）；its pressure drop increase （300%） is lower than that of the porous rib heat sink （330%） and metal foam heat sink （302%），proving that the multi‑scale synergistic effect of metal foam and porous ribs can effectively improve heat dissipation performance.The research can provide references for the design of heat sinks for high‑power density chips.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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