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Experimental study on refrigeration performance of new cabinet semiconductor air conditioning
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Lijun LIU1, 2, Jian SHENG1, 2, Hua ZHANG1, 2, Guanlu XU1
Fluid Machinery | 2025, 53(1) : 17 - 24
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Fluid Machinery | 2025, 53(1): 17-24
Experimental study on refrigeration performance of new cabinet semiconductor air conditioning
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Lijun LIU1, 2, Jian SHENG1, 2, Hua ZHANG1, 2, Guanlu XU1
Affiliations
  • 1School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
  • 2Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering, Shanghai 200093, China
Published: 2025-01-30 doi: 10.3969/j.issn.1005-0329.2025.01.003
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An integrated semiconductor air conditioner for electrical cabinet is designed, and the effects of input current (6~11 A), ambient temperature (20~35 ℃), temperature difference between inside and outside the cabinet (0~40 ℃) and air volume at the hot end on the refrigeration performance of the cabinet semiconductor air conditioner are studied by using the calibrated room calorimeter method. The experimental results indicate that when the ambient temperature is 26 ℃ and the temperature difference between the inside and outside of the box is 20 ℃, the optimal working current of the semiconductor air conditioner is 8 A (36 V), and the refrigeration capacity is the largest (213 W). When the current is 8 A (36 V), with the increase of ambient temperature (20~35 ℃), the cooling capacity and COP increase by 13.9% and 11.9%, respectively. With the increase of temperature difference (0~40 ℃) inside and outside the box, the refrigeration capacity and COP both increase significantly (108~340 W, 0.38~1.21), and the increase of heat exchange capacity is the main reason for the increase of refrigeration capacity. When the air volume of the hot-end fan is increased from 108.63 m3/h to 156 m3/h, the cooling capacity increased by 4.02% and the COP increased by 1.50%. It can provide reference for the design optimization of new cabinet semiconductor air conditioning.

semiconductor refrigeration  /  cabinet air conditioning  /  calorimeter method  /  refrigeration performance
刘丽君, 盛健, 张华, 许贯禄. 新型机柜半导体空调制冷性能试验研究. 流体机械, 2025 , 53 (1) : 17 -24 . DOI: 10.3969/j.issn.1005-0329.2025.01.003
Lijun LIU, Jian SHENG, Hua ZHANG, Guanlu XU. Experimental study on refrigeration performance of new cabinet semiconductor air conditioning[J]. Fluid Machinery, 2025 , 53 (1) : 17 -24 . DOI: 10.3969/j.issn.1005-0329.2025.01.003
Year 2025 volume 53 Issue 1
89
16
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Article Info
doi: 10.3969/j.issn.1005-0329.2025.01.003
  • Receive Date:2024-04-02
  • Online Date:2026-10-15
  • Published:2025-01-30
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  • Received:2024-04-02
  • Revised:2024-08-18
Affiliations
    1School of Energy and Power Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
    2Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering, Shanghai 200093, China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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