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Progress in thermoelectric refrigeration materials,modeling and multi‑field applications
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Huawei ZHANG1, Haihong HU2, Hongjuan WANG2, Kechen TANG2, Kun WEI2, Jianlin YU1
Fluid Machinery | 2026, 54(5) : 80 - 93
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Fluid Machinery | 2026, 54(5): 80-93
Progress in thermoelectric refrigeration materials,modeling and multi‑field applications
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Huawei ZHANG1, Haihong HU2, Hongjuan WANG2, Kechen TANG2, Kun WEI2, Jianlin YU1
Affiliations
  • 1Department of Refrigeration and Cryogenic Engineering,Xi'an Jiaotong University,Xi'an 710049,China
  • 2Hefei Midea Refrigerator Co.,Ltd.,Hefei 230088,China
Published: 2026-05-30 doi: 10.3969/j.issn.1005-0329.2026.05.010
Outline
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To address the shortcomings of traditional vapor‑compression refrigeration technology in terms of volume,energy efficiency,and operational reliability,thermoelectric refrigeration technology has attracted widespread attention due to its high efficiency,environmental friendliness,and high reliability.This paper reviews the latest research progress in thermoelectric refrigeration technology,with a focus on the current status of thermoelectric materials,numerical modeling methods for thermoelectric cooling,and their application scenarios.First,the development history of thermoelectric materials is introduced,and the major achievements are summarized.Second,to improve the performance of thermoelectric cooling systems,models of thermoelectric elements and thermoelectric coolers at different dimensions are compared and analyzed,and the results show that 3D models can more comprehensively describe the microscopic mechanisms during the actual operation of thermoelectric modules.Finally,the application status of thermoelectric refrigeration is summarized from the aspects of electronic cooling,medical equipment,and automotive air conditioning,and it is pointed out that the key to future development lies in improving the intrinsic properties of thermoelectric materials,optimizing the heat dissipation path on the hot side of thermoelectric devices,and further enhancing the system COP,thereby achieving collaborative design of materials,devices,and systems.This study can provide a theoretical reference for the design optimization and engineering application of thermoelectric cooling systems.

thermoelectric refrigeration technology  /  thermoelectric materials  /  thermoelectric cooler  /  thermoelectric cooling system
张华伟, 胡海宏, 王红娟, 唐可琛, 危坤, 鱼剑琳. 热电制冷材料、建模及多领域应用进展. 流体机械, 2026 , 54 (5) : 80 -93 . DOI: 10.3969/j.issn.1005-0329.2026.05.010
Huawei ZHANG, Haihong HU, Hongjuan WANG, Kechen TANG, Kun WEI, Jianlin YU. Progress in thermoelectric refrigeration materials,modeling and multi‑field applications[J]. Fluid Machinery, 2026 , 54 (5) : 80 -93 . DOI: 10.3969/j.issn.1005-0329.2026.05.010
Year 2026 volume 54 Issue 5
88
32
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Article Info
doi: 10.3969/j.issn.1005-0329.2026.05.010
  • Receive Date:2025-07-29
  • Online Date:2026-10-22
  • Published:2026-05-30
Article Data
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History
  • Received:2025-07-29
  • Revised:2026-03-17
Affiliations
    1Department of Refrigeration and Cryogenic Engineering,Xi'an Jiaotong University,Xi'an 710049,China
    2Hefei Midea Refrigerator Co.,Ltd.,Hefei 230088,China
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表12种不同金属材料的力学参数
科
Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)
属
Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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