The effects of different cooling rates in retrogression and re-aging on the microstructure and properties of Al-Zn-Mg-Cu alloy profiles were investigated by performing tests on hardness, electrical conductivity, room temperature tensile, local corrosion and stress corrosion, combined with microstructure characterization by using metallographic microscopy and transmission electron microscopy. The results show that retrogression with cooling rates of 660.0, 12.7 and 0.5 ℃/min, the alloy has a tensile strength of 663.1, 653.4 and 636.9 MPa, an electrical conductivity of 35.1% IACS、35.2% IACS and 36.8% IACS, an exfoliation corrosion in the form of EC, EB-and EB, and a stress corrosion sensitivity of 4.7%, 4.0% and 3.2%, respectively. The precipitates at grain boundaries along the direction of length, with an average size of 48.7, 54.7 and 68.7 nm, are distributed with a spacing of 28.9, 33.6 and 40.3 nm, respectively. The variation in size and distribution is the main reason for variation of the above-mentioned properties. With both mechanical properties and corrosion resistance taken into consideration, it is appropriate to select cooling rates ranging from 0.5 ℃/min to 12.7 ℃/min for retrogression.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |