Chip lithography technology is a pivotal component in the semiconductor manufacturing domain and exemplifies the “root-trunk-branch” characteristics of a complex technology cluster. Its relevance extends beyond individual processes, influencing a country’s comprehensive technological capabilities and industrial competitiveness. However, existing research has offered only limited insight into how these multifaceted core technologies evolve in clusters over time. In an effort to address this knowledge gap, researchers introduced the concept of “root technology,” employing both explicit and implicit relationships derived from patent data to explore the dynamic evolution of key core technologies. By incorporating terminology extraction, clustering analysis, and related methods, they developed an analytical model that delineates the way crucial lithography innovations emerge and transform.

The findings of this study highlight four principal root technologies within the broader chip lithography system—projection exposure technology, direct-write lithography technology, photoresist materials, and photomask manufacturing. Together, they form the backbone of chip lithography’s evolution and diverge into distinct pathways of development. While projection exposure technology tends to merge features from various domains (reflecting a fusion-oriented path), direct-write lithography gradually contracts into more specialized niches, signaling a pattern of consolidation. Photoresist materials expand and diversify to accommodate evolving demands and technical frontiers, illustrating a path of sustained growth. By contrast, photomask manufacturing branches out into multiple subfields, capturing a split-type trajectory that underscores the complexity and range of potential innovations in that area.

This comparative perspective on distinct evolutionary paths accentuates the defining traits of root technologies: they provide a fundamental foundation for subsequent developments; they exhibit high levels of complexity and intricate integration with complementary domains; and they impose significant barriers to entry, owing to their specialized expertise, substantial R&D requirements, and stringent quality standards. Such insights contribute to a deeper understanding of the unique nature of root technologies, advance theoretical frameworks on complex innovation clustering, and add practical value for policymakers and industry leaders.

In particular, these outcomes offer concrete guidance for China’s chip lithography sector, which faces urgent demands for technological breakthroughs. By pinpointing the specific root technologies and clarifying how each one evolves, researchers and practitioners can formulate strategies to distribute resources more effectively, foster targeted collaborations, and stimulate ongoing innovation in lithography manufacturing. Ultimately, appreciating the interconnected yet distinct evolution paths of projection exposure, direct-write lithography, photoresist materials, and photomask manufacturing helps lay the groundwork for robust policy decisions and industrial strategies that will shape the future of semiconductor fabrication.