Latest ArticlesUsing ethyl acrylate (EA) and butyl acrylate (BA) as soft monomers, methyl methacrylate (MMA), styrene (St), and acrylonitrile as hard monomers, methyl Hydroxyethyl acrylate (HEMA) and methacrylic acid (MAA) as crosslinking monomers, sodium dodecyl sulfate (SDS) as emulsifiers, and ammonium persulfate (APS) as initiators, an acrylate base emulsion was prepared through semi-continuous seed emulsion polymerization. And then a modified acrylate adhesive for FPC was prepared by adding suitable amount of curing agent and vulcanizing agent to emulsion. The optimal formulation of the acrylate base emulsion was obtained by simple variable method and orthogonal experiment, that is as follow: m(soft monomer) : m(hard monomer) : m(crosslinking agent) : m(emulsifiers): m(initiators)= 65:30:4:3:0.3, w(SDS)=2%, w(APS)=0.3%. With this formulation, the peel strength of the encapsulation sample is 0.92 N/mm, the peel strength of the single panel is 2.15 N/mm, and the soldering resistance pass rate is 100%, the moisture absorption rate of the film is 3.11%, which can all meet the performance requirements of adhesivein the FPC substrate.
A pure epoxy resin model and an h-BN/EP composite model were established. The thermal, mechanical, and dielectric property of epoxy resin before and after h-BN nano-doping were calculated by molecular dynamics method. And the effect of different h-BN doping content on the properties of epoxy resin was studied. The results show that when the mass fraction of h-BN is 4%-5%, both the thermal conductivity and thermal stability of epoxy resin increase, the rigidity and toughness increase by more than 10%, and the relative dielectric constant reaches the minimum value about 1.236, indicating that the material maintains good dielectric property.
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