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Study on structural design and drawing process of high heat-resistant and low thermal expansion polyimide films
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Jianhua WANG, Gaojie WU, Hongjie XU, Guofeng TIAN, Shengli QI, Dezhen WU*
Insulating Materials | 2026, 59(4) : 1 - 8
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Insulating Materials | 2026, 59(4): 1-8
Material Research
Study on structural design and drawing process of high heat-resistant and low thermal expansion polyimide films
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Jianhua WANG, Gaojie WU, Hongjie XU, Guofeng TIAN, Shengli QI, Dezhen WU*
Affiliations
  • Key Laboratory of Carbon Fiber and Functional Polymers, Ministry of Education, Beijing University of Chemical Technology, Beijing 100029, China
Published: 2026-04-20 doi: 10.16790/j.cnki.1009-9239.im.2026.04.001
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Drawing technology is one of the important methods for preparing electronic-grade polyimide (PI) films used in flexible printed circuits (FPC). Compared to single chemical structure regulation methods, drawing technology offers higher flexibility and can effectively regulate the coefficient of thermal expansion (CTE) of different systems of PI films over a wide range. However, in the pursuit of high glass transition temperature (Tg), monomers with rigid property and hydrogen bond are often partially or fully employed, leading to reduced molecular chain mobility and impairing the drawing processability. This paper addressed the challenging contradiction between the high glass transition temperature (Tg) of polyimide (PI) films and their drawing processability. Taking pyromellitic dianhydride (PMDA) and 4,4′-diaminodiphenyl ether (ODA) as basic system, a series of homopolymer and copolymer PI films were designed and prepared by introducing p-phenylenediamine (p-PDA), 2,5-dimethy-phenylenediamine (DPD), and m-phenylenediamine (m-PDA). Through molecular simulation and experimental analysis, the effects of the main chain structure on its segment mobility and drawing process were studied systematically. The results show that the introduction of m-PDA can simultaneously improve the rigidity of PI molecular chains in the PMDA/ODA system below Tg and the mobility above Tg, thereby enabling it to have a high Tg and excellent drawing processability. By employing DMA for high-temperature drawing and orientation of this system film, PI film samples with high Tg (about 428℃) and CTE-adjustable (1.7×10-6-34.1×10-6-1) were successfully prepared.

electronic-grade PI film  /  drawing process  /  glass transition temperature  /  coefficient of thermal expansion
Jianhua WANG, Gaojie WU, Hongjie XU, Guofeng TIAN, Shengli QI, Dezhen WU. Study on structural design and drawing process of high heat-resistant and low thermal expansion polyimide films[J]. Insulating Materials, 2026 , 59 (4) : 1 -8 . DOI: 10.16790/j.cnki.1009-9239.im.2026.04.001
Year 2026 volume 59 Issue 4
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doi: 10.16790/j.cnki.1009-9239.im.2026.04.001
  • Receive Date:2025-05-19
  • Online Date:2026-09-10
  • Published:2026-04-20
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  • Received:2025-05-19
  • Revised:2025-06-15
Affiliations
    Key Laboratory of Carbon Fiber and Functional Polymers, Ministry of Education, Beijing University of Chemical Technology, Beijing 100029, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.04.001
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
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Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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