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To address the problems of poor solution processability, high dielectric constant, and low adhesion of thermoplastic polyimide (TPI) used for adhesive-free flexible copper clad laminates (FCCL), a soluble easter-containing TPI (PI-10) was synthesized via a two-step method involving solution copolycondensation and chemical imidization. Then PI-10 was chemically modified with dicyclopentadiene epoxy resin (HP7200) and fabricated into FCCL. Firstly, the chemical structure of PI-10 was confirmed by FTIR and ¹H-NMR, and then its organic solubility and molecular weight were tested. Subsequently, the curing kinetics behavior and process of HP7200 modified PI-10 (PI-10/HP7200) were investigated by non-isothermal DSC analysis. Finally, the properties of PI-10, PI-10/HP7200, and the prepared FCCL were studied. The results show that PI-10 has good organic solubility and high molecular weight. Compared with PI-10, the tensile strength of PI-10/HP7200 film increases from (97.37±1.68) MPa to (102.25±4.77) MPa, and the dielectric constant (Dk) at 10 GHz decreases from 3.10 to 2.83. However, its glass transition temperature (Tg) decreases from 213.5℃ to 204.2℃, the 5% weight loss temperature (Td5) decreases from 496.9℃ to 451.8℃, and the coefficient of thermal expansion (CTE) within 50-150℃ increases from 66.20×10-6℃-1 to 73.15×10-6℃-1, water absorption increases from 2.59% to 3.57%, and the dielectric loss factor (Df) at 10 GHz increases from 0.009 5 to 0.015 8. In addition, PI-10/HP7200 significantly enhances the 90° peel strength of the prepared FCCL, achieving a maximum increase of about 77% compared to PI-10 without sacrificing other properties, reaching 2.12 N/mm.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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