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Co-curing of TAIC with TMBPA-MPPO: synchronous enhancement of bulk properties for high-speed and low-loss substrates
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Zhenzhen TAN1, Xu WANG2, Lingyu LI1, Jiachun ZHONG1, *, Mengjie YUE1, Kaijie YANG1
Insulating Materials | 2026, 59(6) : 141 - 148
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Insulating Materials | 2026, 59(6): 141-148
Co-curing of TAIC with TMBPA-MPPO: synchronous enhancement of bulk properties for high-speed and low-loss substrates
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Zhenzhen TAN1, Xu WANG2, Lingyu LI1, Jiachun ZHONG1, *, Mengjie YUE1, Kaijie YANG1
Affiliations
  • 1College of Materials Science and Engineering, Sichuan University of Science & Engineering, Zigong 643000, China
  • 2Haohua Yuhang Chemical Company Limited, Jiaozuo 454002, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.014
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In this study, tetramethylbisphenol A (TMBPA) was used as the bisphenol source, and a dihydroxy-terminated oligomeric polyphenylene ether resin (TMBPA-MPPO) was synthesized via monomer copolymerization. Further, through a nucleophilic substitution reaction, TMBPA-MPPO was end-capped with chloromethylstyrene (VBC) to prepare a crosslinkable polyphenylene ether resin MPPO-VBC. The product structure was characterized by FT-IR, and the dielectric properties, thermal properties, and moisture absorption of the cured product were systematically evaluated. The results show that MPPO-VBC has good curing activity, and after curing it exhibits excellent dielectric properties (dielectric constant is 2.60, dielectric loss factor is 0.004 5 at 1 MHz) and heat resistance (Tg=200℃). On this basis, MPPO-VBC was blended with triallyl isocyanurate (TAIC), coated onto glass fiber cloth, and a composite was prepared. Its dielectric loss factor further decreased to 0.001 4, the glass transition temperature increased to 221.4℃, and the tensile strength and flexural strength reached 212 MPa and 267 MPa, respectively, demonstrating application potential in high-frequency copper-clad laminates.

polyphenylene ether  /  crosslinkable resin  /  cyanate ester  /  dielectric properties  /  composite materials
Zhenzhen TAN, Xu WANG, Lingyu LI, Jiachun ZHONG, Mengjie YUE, Kaijie YANG. Co-curing of TAIC with TMBPA-MPPO: synchronous enhancement of bulk properties for high-speed and low-loss substrates[J]. Insulating Materials, 2026 , 59 (6) : 141 -148 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.014
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Year 2026 volume 59 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2026.06.014
  • Receive Date：2025-09-13
  • Online Date：2026-09-10
  • Published：2026-06-20
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  • Received：2025-09-13
  • Revised：2025-10-21
Affiliations
    1College of Materials Science and Engineering, Sichuan University of Science & Engineering, Zigong 643000, China
    2Haohua Yuhang Chemical Company Limited, Jiaozuo 454002, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.06.014
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Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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