Home Journals Articles Updates About
CN
image
收藏切换
Molecular structural design and research progress of low-dielectric, low-loss polyimide film materials
收藏切换
PDF
Yonghao LIU1, Chenggang ZHANG2, Lan JIANG1, Peng XIAO1, 2, *
Insulating Materials | 2026, 59(6) : 1 - 9
Less
收藏切换
Insulating Materials | 2026, 59(6): 1-9
Molecular structural design and research progress of low-dielectric, low-loss polyimide film materials
Full
Yonghao LIU1, Chenggang ZHANG2, Lan JIANG1, Peng XIAO1, 2, *
Affiliations
  • 1Institute of Micro/Nano Materials and Devices, Ningbo University of Technology, Ningbo 315211, China
  • 2School of Chemical Science and Engineering, Tongji University, Shanghai 200092, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.001
Outline
收藏切换

Polyimide (PI), as a type of special polymer materials with excellent comprehensive properties, is widely used in various fields such as electronics and electrical engineering, electrical insulation, and aerospace. However, with the rapid advancement of 5G/6G high-frequency communication technologies, higher requirements have been put forward on the dielectric properties of dielectric layer materials in electronic devices. PI faces significant challenges, including its inherently high dielectric constant (Dk) and dielectric loss (Df), as well as relatively high-water absorption, which restrict its further development in related applications. In this paper, the intrinsic action mechanism of Dk and Df of polymers under electric field was introduced at first, and then the main research progress of low-Dk and low-Df polyimide films in recent years, as well as the modification strategies of polymer molecular structure and dielectric properties were reviewed respectively. Finally, the research direction of low-Dk and low-Df polyimide films was summarized and prospected.

polyimide films  /  dielectric constant  /  dielectric loss  /  structural modification
Yonghao LIU, Chenggang ZHANG, Lan JIANG, Peng XIAO. Molecular structural design and research progress of low-dielectric, low-loss polyimide film materials[J]. Insulating Materials, 2026 , 59 (6) : 1 -9 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.001
Appendix
Less
Year 2026 volume 59 Issue 6
PDF
72
40
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2026.06.001
  • Receive Date：2025-10-19
  • Online Date：2026-09-10
  • Published：2026-06-20
Article Data
Affiliations
History
  • Received：2025-10-19
  • Revised：2025-12-06
Affiliations
    1Institute of Micro/Nano Materials and Devices, Ningbo University of Technology, Ningbo 315211, China
    2School of Chemical Science and Engineering, Tongji University, Shanghai 200092, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.06.001
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62199257
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House