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Application and development trend of low Dk/Df materials in flexible printed circuit boards field
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Lifang ZHENG, Jiancheng CAO, Zongmin HU
Insulating Materials | 2026, 59(6) : 74 - 81
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Insulating Materials | 2026, 59(6): 74-81
Application and development trend of low Dk/Df materials in flexible printed circuit boards field
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Lifang ZHENG, Jiancheng CAO, Zongmin HU
Affiliations
  • MFLEX (Yan Cheng) Co., Ltd., Yancheng 224000, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.007
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With the deployment of 5G and the outlook toward 6G, flexible printed circuits (FPC) are facing more stringent requirements in high‑frequency, high‑speed signal transmission, and dielectric constant (Dk) and dielectric loss factor (Df) are key parameters determining signal attenuation and time delay. This paper reviewed the current state and application challenges of key insulating materials for FPC, focusing on the performance advantages, modification strategies, and industrialization progress of modified polyimide (MPI) and liquid crystal polymer (LCP) as high‑frequency dielectric substrates. It also analyzed the challenges in formulation design, filler selection and process compatibility of modified polyimide and polyolefin systems used for high-frequency pure adhesive films. In addition, the potential of low‑Dk/Df polymers such as fluorinated resins was evaluated, the trade-offs among electrical properties, processability and cost were discussed, and suggestions for future research and industrialization pathways of high-frequency FPC materials were proposed.

flexible printed circuits boards  /  high-frequency and high-speed  /  low Dk/Df material  /  polyimide  /  liquid crystal polymer
Lifang ZHENG, Jiancheng CAO, Zongmin HU. Application and development trend of low Dk/Df materials in flexible printed circuit boards field[J]. Insulating Materials, 2026 , 59 (6) : 74 -81 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.007
Year 2026 volume 59 Issue 6
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doi: 10.16790/j.cnki.1009-9239.im.2026.06.007
  • Receive Date:2025-10-16
  • Online Date:2026-09-10
  • Published:2026-06-20
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  • Received:2025-10-16
  • Revised:2025-12-11
Affiliations
    MFLEX (Yan Cheng) Co., Ltd., Yancheng 224000, China
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表12种不同金属材料的力学参数

Family
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Number of
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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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