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Research progress on low dielectric constant inorganic dielectric materials for 5G/6G wireless communications and advanced packaging technologies
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Jian BAO, Zhengqiao LI, Jing GUO, Changhao WANG, Zhaochen XI, Di ZHOU*
Insulating Materials | 2026, 59(6) : 10 - 24
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Insulating Materials | 2026, 59(6): 10-24
Research progress on low dielectric constant inorganic dielectric materials for 5G/6G wireless communications and advanced packaging technologies
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Jian BAO, Zhengqiao LI, Jing GUO, Changhao WANG, Zhaochen XI, Di ZHOU*
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  • School of Electronic Science and Engineering, Xi′an Jiaotong University, Xi′an 710049, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.002
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Functional inorganic dielectric materials with low dielectric constants (εr<10), represented by ceramic materials, glass-ceramic composites, and microcrystalline glass, play an irreplaceable role in cutting-edge technologies such as high-frequency and high-speed communications, high-density integrated packaging, and high-reliability electronic devices. Among these, high-temperature co-fired ceramic (HTCC) technology employs high-strength alumina ceramics, high thermal conductivity aluminum nitride ceramics, or low-dielectric-constant silicon-based ceramics as insulating packaging materials. Low-temperature/ultra-low-temperature co-fired ceramic (LTCC/ULTCC) technology employs intrinsically low-sintering-temperature ceramics, sintering aid-reduced sintering-temperature ceramics, glass-ceramic composites, and microcrystalline glass as packaging materials. This paper elaborated and summarized the above low-dielectric-constant inorganic dielectric materials, and prospected the application of machine learning (ML) in the prediction and design of novel low-dielectric and low-loss packaging materials, providing a new route for the development of related systems.

low dielectric constant  /  HTCC  /  LTCC/ULTCC  /  machine learning
Jian BAO, Zhengqiao LI, Jing GUO, Changhao WANG, Zhaochen XI, Di ZHOU. Research progress on low dielectric constant inorganic dielectric materials for 5G/6G wireless communications and advanced packaging technologies[J]. Insulating Materials, 2026 , 59 (6) : 10 -24 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.002
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Year 2026 volume 59 Issue 6
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doi: 10.16790/j.cnki.1009-9239.im.2026.06.002
  • Receive Date：2025-10-22
  • Online Date：2026-09-10
  • Published：2026-06-20
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  • Received：2025-10-22
  • Revised：2025-12-22
Affiliations
    School of Electronic Science and Engineering, Xi′an Jiaotong University, Xi′an 710049, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2026.06.002
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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