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Preparation and performance study of epoxy resin/modified boron nitride composites
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Lingjun LIU1, Qianqian LIANG2, 3, Zhihui XIE1, 2, Mingpeng HE1, Zhiyu CHEN2, Jin AN2, Jinyao CHEN1, Yue ZHANG1, *, Jian KANG2, *
Insulating Materials | 2026, 59(6) : 160 - 169
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Insulating Materials | 2026, 59(6): 160-169
Preparation and performance study of epoxy resin/modified boron nitride composites
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Lingjun LIU1, Qianqian LIANG2, 3, Zhihui XIE1, 2, Mingpeng HE1, Zhiyu CHEN2, Jin AN2, Jinyao CHEN1, Yue ZHANG1, *, Jian KANG2, *
Affiliations
  • 1Dongfang Electric Machinery Co., Ltd., Deyang 618000, China
  • 2State Key Laboratory of Advanced Polymer Materials, Polymer Research Institute of Sichuan University, Chengdu 610065, China
  • 3National Insulation Material Engineering Technical Research Center, Mianyang 621000, China
Published: 2026-06-20 doi: 10.16790/j.cnki.1009-9239.im.2026.06.016
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In order to solve the problems of poor dispersibility and weak interface bonding of nano hexagonal boron nitride (BN) in epoxy resin (EP), and to improve the comprehensive performance of EP composite, we used polydopamine (PDA) to modify the surface of BN, and prepared EP/m-BN composites. The microstructure and dispersibility of the modified BN was characterized by Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), transmission electron microscopy (TEM), atomic force microscopy (AFM) and other methods. The thermal conductivity, mechanical properties, dielectric properties, and thermal expansion characteristics of EP and EP/BN composites were systematically tested. The results show that PDA forms a uniform coating layer on the surface of BN through self polymerization, introducing active functional groups such as hydroxyl and amino groups, which significantly inhibits the aggregation of BN and improves its dispersibility in EP. Performance tests indicate that the composite achieves optimal overall performance at an m-BN loading of 10%. Compared with pure EP, the thermal conductivity of EP/m-BN composite increases from 0.21 W/(m·K) to 0.47 W/(m·K), with an increase of 123.8%. The coefficient of linear thermal expansion decreases from 59.2×10-6-1 to 45.5×10-6-1, with a decrease of 23.1%. The tensile strength increases from 42.6 MPa to 58.6 MPa, with an increase of 37.6%. The elongation at break increases from 18.8% to 23.6%, with an increase of 25.5%. And within the frequency range of 10-106 Hz, all EP/m-BN composites maintain a low dielectric constant of 3.5-4, and the composites with 5%-10% of m-SiO2 show a dielectric loss close to pure EP and excellent stability.

epoxy resin  /  boron nitride  /  polydopamine modification  /  dielectric properties  /  mechanical properties
Lingjun LIU, Qianqian LIANG, Zhihui XIE, Mingpeng HE, Zhiyu CHEN, Jin AN, Jinyao CHEN, Yue ZHANG, Jian KANG. Preparation and performance study of epoxy resin/modified boron nitride composites[J]. Insulating Materials, 2026 , 59 (6) : 160 -169 . DOI: 10.16790/j.cnki.1009-9239.im.2026.06.016
Year 2026 volume 59 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2026.06.016
  • Receive Date:2025-09-25
  • Online Date:2026-09-10
  • Published:2026-06-20
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History
  • Received:2025-09-25
  • Revised:2025-10-19
Affiliations
    1Dongfang Electric Machinery Co., Ltd., Deyang 618000, China
    2State Key Laboratory of Advanced Polymer Materials, Polymer Research Institute of Sichuan University, Chengdu 610065, China
    3National Insulation Material Engineering Technical Research Center, Mianyang 621000, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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