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Solvent-free Preparation and Characterization of Thermal Insulating Composite with Light Weight and High Strength
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Bo LI1, 2, Lijun LI1, Pengfei YANG1, Jinxin ZHANG1, Xianqi FENG1
Insulating Materials | 2021, 54(12) : 32 - 37
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Insulating Materials | 2021, 54(12): 32-37
• Material Research •
Solvent-free Preparation and Characterization of Thermal Insulating Composite with Light Weight and High Strength
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Bo LI1, 2, Lijun LI1, Pengfei YANG1, Jinxin ZHANG1, Xianqi FENG1
Affiliations
  • 1R&D Center of Novel Materials, Beijing New Friend Insulation Materials Co., Ltd., Beijing 101111, China
  • 2School of Chemistry and Chemical Engineering, Beijing Institute of Technology, Beijing 100081, China
Published: 2021-12-20 doi: 10.16790/j.cnki.1009-9239.im.2021.12.006
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A series of thermal insulating EPG composite with high performance and light wight were prepared through solvent-free BMC thermocompression technique using multifunctional group epoxy resin (MF4101) as matrix, methyl tetrahydrophthalic anhydride as curing agent, and hollow glass beads with high strength as filler and thermal insulating phase. And the structure, mechanical properties, and thermal properties of the composite were studied. The results show that the average particle size of hollow glass beads is 25.6 μm, and it remains intact in the composite. When the amount of hollow glass beads is 80, 120, and 140 phr, the density of EPG composite is 0.82, 0.72, and 0.71 g/cm3, respectively; the compressive strength is 105.7, 68.1, and 67.4 MPa, respectively; the thermal conductivity is low, the value is 0.012 9, 0.085 4, and 0.0826 W/(m·K), respectively. Besides, with high glass transition temperatures and epitaxial degradation temperatures (>300℃), the EGP composite material can be used under high temperature and high pressure for a long time.

light weight  /  high strength  /  thermal insulating composite
Bo LI, Lijun LI, Pengfei YANG, Jinxin ZHANG, Xianqi FENG. Solvent-free Preparation and Characterization of Thermal Insulating Composite with Light Weight and High Strength[J]. Insulating Materials, 2021 , 54 (12) : 32 -37 . DOI: 10.16790/j.cnki.1009-9239.im.2021.12.006
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.12.006
  • Receive Date：2021-01-30
  • Online Date：2026-03-23
  • Published：2021-12-20
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History
  • Received：2021-01-30
  • Revised：2021-02-24
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    1R&D Center of Novel Materials, Beijing New Friend Insulation Materials Co., Ltd., Beijing 101111, China
    2School of Chemistry and Chemical Engineering, Beijing Institute of Technology, Beijing 100081, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.12.006
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Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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