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Preparation and Properties of Polyimide Films Modified with Colloidal Silica Fillers
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Yanjiang JIA1, Yuancheng AN1, Yan ZHANG1, Xinxin ZHI1, Xiumin ZHANG2, Jingang LIU1, Yang YANG3
Insulating Materials | 2021, 54(11) : 100 - 107
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Insulating Materials | 2021, 54(11): 100-107
Polyimide Film Special Issue
Preparation and Properties of Polyimide Films Modified with Colloidal Silica Fillers
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Yanjiang JIA1, Yuancheng AN1, Yan ZHANG1, Xinxin ZHI1, Xiumin ZHANG2, Jingang LIU1, Yang YANG3
Affiliations
  • 1School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
  • 2School of Electrical Engineering, Beijing Jiaotong University, Beijing 100044, China
  • 3Composites Center of Commercial Aircraft Corporation of China, Ltd., Shanghai 201324, China
Published: 2021-11-22 doi: 10.16790/j.cnki.1009-9239.im.2021.11.014
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At First, a poly(amic acid) (PAA) based on pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) was prepared by polycondensation procedure, and the PAA/SiO2 composite solutions were obtained by adding different mass fraction of colloidal SiO2/N,N-dimethylacetamide (DMAc) during the polymerization. Then a series of PI/SiO2 composite films were prepared by thermal imidization of the PAA/SiO2 composite solutions in a clean oven from room temperature to 350℃ in nitrogen. The PI composite films were characterized by the attenuated total reflectance Fourier transform infrared (ATR-FTIR), scanning electron microscopy (SEM), thermal-gravimetric analysis (TGA), dynamic mechanical analysis (DMA), and thermo-mechanical analysis (TMA), and the effect of SiO2 on the dielectric properties of composite film was tested by the impedance analysis measurement. The results show that the composite films with expected structure are prepared, and the SiO2 disperses in PI matrix uniformly. The incorporation of SiO2 improves the heat resistance and dimensional stability at high temperature of the PI composite films. The 5% weight loss temperature (T5%) and 750℃ residual weight ratio (Rw750) of the PI-25 film with 25% of SiO2 are 611.3℃ and 73.1%, respectively, which are 14.7℃ and 9.2% higher than those of the PI-0 film (without silica). The PI composite films exhibit stable dielectric constant (Dk) and dielectric loss factor (Df) in the frequency range of 103-106 Hz. The incorporation of nano-silica slightly increases the Dk of composite films, and the Dk of the PI-25 film at 1 MHz is 3.58, which is a bit higher than that of the PI-0 film (Dk is 3.20).

polyimide film  /  colloidal silica  /  dielectric properties  /  thermal properties  /  compatibility
Yanjiang JIA, Yuancheng AN, Yan ZHANG, Xinxin ZHI, Xiumin ZHANG, Jingang LIU, Yang YANG. Preparation and Properties of Polyimide Films Modified with Colloidal Silica Fillers[J]. Insulating Materials, 2021 , 54 (11) : 100 -107 . DOI: 10.16790/j.cnki.1009-9239.im.2021.11.014
Year 2021 volume 54 Issue 11
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.11.014
  • Receive Date:2020-12-09
  • Online Date:2026-03-23
  • Published:2021-11-22
Article Data
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History
  • Received:2020-12-09
  • Revised:2021-04-07
Funding
Affiliations
    1School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
    2School of Electrical Engineering, Beijing Jiaotong University, Beijing 100044, China
    3Composites Center of Commercial Aircraft Corporation of China, Ltd., Shanghai 201324, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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