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Research Progress in Low Expansion Polyimide Films for Electronic Devices
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Xiaochuang LU1, Wentao YU1, Mengman WENG1, Yidong LIU1, Jisheng ZHANG2, Jiyong FANG2, Yonggang MIN1
Insulating Materials | 2021, 54(11) : 11 - 22
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Insulating Materials | 2021, 54(11): 11-22
• Polyimide Film Special Issue •
Research Progress in Low Expansion Polyimide Films for Electronic Devices
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Xiaochuang LU1, Wentao YU1, Mengman WENG1, Yidong LIU1, Jisheng ZHANG2, Jiyong FANG2, Yonggang MIN1
Affiliations
  • 1School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
  • 2Huimai Material Technology (Guangdong) Co., Ltd., Foshan 528200, China
Published: 2021-11-22 doi: 10.16790/j.cnki.1009-9239.im.2021.11.002
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In recent years, flexible electronic devices have developed rapidly. As a flexible substrate material and dielectric insulating material, polyimide (PI) film has been widely used in the preparation of flexible electronic devices and flexible circuit boards. However, its high thermal expansion coefficient reduces its dimensional stability in the process of variable temperature processing. Therefore, it is necessary to adjust its thermal expansion coefficient to match with other materials of electronic devices. In this paper, the patent status of low expansion polyimide films at home and abroad, the preparation and application research progress of low expansion polyimide composite films were introduced, and the general trend of synthesis, modification and application research of low expansion PI was forecasted.

polyimide  /  electron device  /  patent layout  /  low expansion
Xiaochuang LU, Wentao YU, Mengman WENG, Yidong LIU, Jisheng ZHANG, Jiyong FANG, Yonggang MIN. Research Progress in Low Expansion Polyimide Films for Electronic Devices[J]. Insulating Materials, 2021 , 54 (11) : 11 -22 . DOI: 10.16790/j.cnki.1009-9239.im.2021.11.002
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.11.002
  • Receive Date：2021-05-17
  • Online Date：2026-03-23
  • Published：2021-11-22
Article Data
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History
  • Received：2021-05-17
  • Revised：2021-07-16
Funding
Affiliations
    1School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
    2Huimai Material Technology (Guangdong) Co., Ltd., Foshan 528200, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.11.002
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