The linear expansion coefficient of cured E51 epoxy resin was tested by using the TMA mode of DMA, and the effects of curing agent types (methyltetrahydrophthalic anhydride (MeTHPA), 4,4-diaminodiphenylmethane (DDM), dicyandiamide (dicy)), and filler powder types and dosage on its linear expansion coefficient were analyzed. The results show that when T<Tg, the linear expansion coefficient of cured E51/Dicy is smaller than that of cured E51/MeTHPA and E51/DDM. When T>Tg, the linear expansion coefficient of cured E51/dicy is larger than that of cured E51/MeTHPA and E51/DDM. After filling SiO2, Al(OH)3, and Al2O3 respectively, the linear expansion coefficient of the epoxy composites are significantly lower than that of pure epoxy material, and the linear expansion coefficients of the epoxy composite filled with Al2O3 is the smallest. With the increase of inorganic filler content, the linear expansion coefficient of the epoxy composite decreases. However, when the mass fraction of inorganic fillers is 70%–80%, the linear expansion coefficient changes little with the change of filler content.
| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |