Home Journals Articles Updates About
CN
image
收藏切换
Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System
收藏切换
PDF
Liucheng HAO1, Duanpeng YUAN1, Rui CHEN1, Ziyang ZHANG2, Yushun ZHAO2, Qing XIE3, Bo WANG4, Zhongxiao SONG4
Insulating Materials | 2021, 54(1) : 73 - 77
Less
收藏切换
Insulating Materials | 2021, 54(1): 73-77
• Test and Analysis •
Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System
Full
Liucheng HAO1, Duanpeng YUAN1, Rui CHEN1, Ziyang ZHANG2, Yushun ZHAO2, Qing XIE3, Bo WANG4, Zhongxiao SONG4
Affiliations
  • 1High Voltage Switchgear Insulating Materials Laboratory of State Grid, Pinggao Group Co., Ltd., Pingdingshan 467001, China
  • 2School of Electrical Engineering and Automation, Hefei University of Technology, Hefei 230009, China
  • 3State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Baoding 071003, China
  • 4State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
Published: 2021-01-20 doi: 10.16790/j.cnki.1009-9239.im.2021.01.013
Outline
收藏切换

In order to explore the effect of compound anhydride curing agent on the cured product of epoxy resin, we built crosslinking models of methyl tetrahydrophthalic anhydride (MTHPA)/phthalic anhydride (PA) (their compounding ratio was 10:0, 9:1, 7:3, 5:5, 0:10, respectively) and bisphenol A-type glycidyl ether (DGEBA) by molecular dynamics method. The effect of different compounding ratios on the structure, thermal properties, and mechanical properties of the crosslinking epoxy resin with the same crosslinking degree was studied. The results show that when the compounding ratio of MTHPA and PA is 10:0, the free volume proportion of system reaches maximum, and the motion ability of molecular chains is the strongest. When the compounding ratio is 7:3, the comprehensive mechanical properties of system reach the maximum. When the compounding ratio is 9:1 and 7:3, the glass transition temperature of system reaches the highest and the lowest, respectively.

epoxy resin  /  acid anhydride curing agent  /  mechanical properties  /  glass transition temperature  /  molecular simulation
Liucheng HAO, Duanpeng YUAN, Rui CHEN, Ziyang ZHANG, Yushun ZHAO, Qing XIE, Bo WANG, Zhongxiao SONG. Molecular Dynamics Simulation on Effect of Compound Curing Agent on Properties of Epoxy Resin System[J]. Insulating Materials, 2021 , 54 (1) : 73 -77 . DOI: 10.16790/j.cnki.1009-9239.im.2021.01.013
Appendix
Less
Year 2021 volume 54 Issue 1
PDF
82
36
Cite this Article
BibTeX
Article Info
doi: 10.16790/j.cnki.1009-9239.im.2021.01.013
  • Receive Date：2020-03-03
  • Online Date：2026-01-26
  • Published：2021-01-20
Article Data
Affiliations
History
  • Received：2020-03-03
  • Revised：2020-06-12
Funding
Affiliations
    1High Voltage Switchgear Insulating Materials Laboratory of State Grid, Pinggao Group Co., Ltd., Pingdingshan 467001, China
    2School of Electrical Engineering and Automation, Hefei University of Technology, Hefei 230009, China
    3State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Baoding 071003, China
    4State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an 710049, China
References
Share
https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2021.01.013
Share to
QR

Scan QR to access full text

Cite this article
BibTeX
Citations
表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
关闭全屏
  • BibTeX
  • EndNote
  • RefWorks
  • TxT
Links
Articles
Latest Articles
Most Read
Collections
Updates
Events
News
Multimedia
About
About Us
Contact
No. 86 Xueyuan South Road, Haidian District, Beijing
100081
010-62199257
qkjq@cast.org.cn

Copyright © 2025 China Association for Science and Technology. All rights reserved. For all open access content, the relevant licensing terms apply.
Sponsored by the Office of the Leading Group for Cybersecurity and Informatization of CAST, and supported by Science and Technology Review Publishing House