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Synthesis and properties of high heat-resistant dicyclopentadiene epoxy resin for PCB substrates
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Xiaoqiong ZHI1, 2, Anbin TANG1, 2, Xiuyun LI1, Jie HUANG2, Ting PANG2, Xi LIAO2
Insulating Materials | 2024, 57(11) : 98 - 105
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Insulating Materials | 2024, 57(11): 98-105
• Material Research •
Synthesis and properties of high heat-resistant dicyclopentadiene epoxy resin for PCB substrates
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Xiaoqiong ZHI1, 2, Anbin TANG1, 2, Xiuyun LI1, Jie HUANG2, Ting PANG2, Xi LIAO2
Affiliations
  • 1School of Materials and Chemistry, Southwest University of Science and Technology, Mianyang 621000, China
  • 2National Insulating Material Engineering Research Center, Sichuan EM Technology Co., Ltd., Mianyang 621000, China
Published: 2024-11-20 doi: 10.16790/j.cnki.1009-9239.im.2024.11.012
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A high heat resistant o-allylphenol-dicyclopentadiene epoxy resin was synthesized using dicyclopentadiene, o-allylphenol, and epichlorohydrin as raw materials, and its structure was characterized by infrared spectrum and gel chromatography. Then the epoxy resin was cured with bisphenol-A phenolic resin, benzoxazine resin, and active ester respectively, and a PCB substrate was pressed. The curing behavior of the system was studied by differential scanning calorimetry and thermogravimetric analysis. The mechanical properties, dielectric properties, and water absorption properties of the PCB substrate were tested, and compared with the curing system of phenol-dicyclopentadiene epoxy resin. The results show that compared with phenol-dicyclopentadiene epoxy resin, the o-allylphenol-dicyclopentadiene epoxy resin has higher heat resistance (glass transition temperature Tg and 5% thermogravimetric temperature Td5% are higher), bending strength, impact strength, high temperature bending strength retention, and better dielectric properties, lower water absorption.

high heat resistance  /  o-allylphenol-dicyclopentadiene epoxy resin  /  mechanical properties  /  dielectric properties  /  water absorption rate
Xiaoqiong ZHI, Anbin TANG, Xiuyun LI, Jie HUANG, Ting PANG, Xi LIAO. Synthesis and properties of high heat-resistant dicyclopentadiene epoxy resin for PCB substrates[J]. Insulating Materials, 2024 , 57 (11) : 98 -105 . DOI: 10.16790/j.cnki.1009-9239.im.2024.11.012
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doi: 10.16790/j.cnki.1009-9239.im.2024.11.012
  • Receive Date：2024-01-02
  • Online Date：2025-12-24
  • Published：2024-11-20
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  • Received：2024-01-02
  • Revised：2024-03-14
Affiliations
    1School of Materials and Chemistry, Southwest University of Science and Technology, Mianyang 621000, China
    2National Insulating Material Engineering Research Center, Sichuan EM Technology Co., Ltd., Mianyang 621000, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.11.012
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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