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Relationship between comprehensive properties of low dielectric ink containing multi-fluorinated poly(aryl ether) and active diluents
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Bo YUAN
Insulating Materials | 2024, 57(8) : 46 - 51
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Insulating Materials | 2024, 57(8): 46-51
Material Research
Relationship between comprehensive properties of low dielectric ink containing multi-fluorinated poly(aryl ether) and active diluents
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Bo YUAN
Affiliations
  • The tenth Research Institute of China Electronics Technology Group Corporation, Chengdu 610036, China
Published: 2024-08-20 doi: 10.16790/j.cnki.1009-9239.im.2024.08.005
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With the rapid development in the field of microelectronics and microelectronics processing technology, manufacturing microelectronic devices using inkjet printing technology has become a popular direction in additive manufacturing. In this paper, an UV-curable vinyl-terminated polyarylether prepolymer was prepared by nucleophilic substitution reaction with twisted non-coplanar phthalazinone and hexafluoroisopropyl as structural units. A new low dielectric ink system for 3D printing was constructed by using diacrylate reactive diluents and free radical fast initiators into the prepolymer. The results show that the viscosity of the ink system before curing is lower than 300 mPa·s,indicating good processability. After UV and thermal curing, the infrared testing shows that the curing degree can reach over 87%, and the curing is basically complete. The minimum volume shrinkage is only 2.4%, which indicate the ink has excellent dimensional stability. The glass transition temperature of the material can reach up to 210℃, and the thermal decomposition temperature can reach up to 370℃, which indicate the ink has the potential of long-term use at 150℃. At 10 GHz, the dielectric constant of the material can reach 2.61, and the dielectric loss factor is only 0.014, which indicate the ink has excellent dielectric properties. The ink system prepared in this study is applicable to the additive manufacturing process of large curvature conformal circuit and has good application prospect in the field of microelectronics.

UV curing  /  3D printing  /  low dielectric constant  /  phthalazinone  /  polyarylether
Bo YUAN. Relationship between comprehensive properties of low dielectric ink containing multi-fluorinated poly(aryl ether) and active diluents[J]. Insulating Materials, 2024 , 57 (8) : 46 -51 . DOI: 10.16790/j.cnki.1009-9239.im.2024.08.005
Year 2024 volume 57 Issue 8
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doi: 10.16790/j.cnki.1009-9239.im.2024.08.005
  • Receive Date:2023-05-14
  • Online Date:2025-12-24
  • Published:2024-08-20
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  • Received:2023-05-14
  • Revised:2024-04-22
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    The tenth Research Institute of China Electronics Technology Group Corporation, Chengdu 610036, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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