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Epoxy resin has been widely used in the field of insulating materials due to its excellent mechanical properties, thermal stability, chemical stability, and electrical insulation. The stable three-dimensional cross-linked network structure not only gives epoxy resin excellent properties, but also brings great difficulties to its reprocessing, degradation, and recycling. At this stage, more and more researches have begun to focus on the environmentally friendly epoxy resin materials to solve problems such as reprocessing and degradation. In this paper, several typical design ideas and methods of epoxy resin based on dynamic covalent bonds were reviewed, and the environmentally friendly epoxy resin materials through introducting ester bonds, disulfide bonds, silicon-oxygen bonds, imine bonds, D-A structure, acetal bonds, host-guest interaction, and multiple dynamic bonds into the epoxy resin were introduced emphatically. Meanwhile, it is introduced that the topology structure of epoxy resin cross-linked network can be reversibly changed by dynamic covalent bonds under certain stimuli to realize the function of remodeling, reprocessing, self-repairing, and degradation. Finally, the application prospects of insulating materials based on dynamic covalent bonds were summarized and prospected.
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| 科 Family | 属数 Number of genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) | 属 Genus | 种数 Number of species | 占总种数比例 Percentage of total species (%) |
|---|---|---|---|---|---|---|
| 鹅膏菌科Amanitaceae | 2 | 11 | 5.26 | 鹅膏菌属 Amanita | 10 | 4.78 |
| 小菇科 Mycenaceae | 2 | 12 | 5.74 | 丝盖伞属 Inocybe | 5 | 2.39 |
| 多孔菌科 Polyporaceae | 8 | 14 | 6.70 | 蜡蘑属 Laccaria | 5 | 2.39 |
| 红菇科 Russulaceae | 3 | 23 | 11.00 | 小皮伞属 Marasmius | 6 | 2.87 |
| 小菇属 Mycena | 11 | 5.26 | ||||
| 光柄菇属 Pluteus | 5 | 2.39 | ||||
| 红菇属 Russula | 17 | 8.13 | ||||
| 栓菌属 Trametes | 5 | 2.39 |
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