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Preparation and Properties of Solution-processable Transparent Fluoro-containing Polyimide Films with Low Thermal Expansion
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Hanli WANG1, Lin WU2, Xinxin ZHI2, Yanshuang GAO2, Yan ZHANG2, Jingang LIU2
Insulating Materials | 2022, 55(10) : 6 - 13
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Insulating Materials | 2022, 55(10): 6-13
• Material Research •
Preparation and Properties of Solution-processable Transparent Fluoro-containing Polyimide Films with Low Thermal Expansion
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Hanli WANG1, Lin WU2, Xinxin ZHI2, Yanshuang GAO2, Yan ZHANG2, Jingang LIU2
Affiliations
  • 1Shandong Huaxiashenzhou New Material Co., Ltd., Zibo 256401, China
  • 2School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
Published: 2022-10-20 doi: 10.16790/j.cnki.1009-9239.im.2022.10.002
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Three kinds of soluble polyimide (PI) resins were prepared from 4,4′-hexafluoroisopropylidene)bisphthalic anhydride (6FDA) and three kinds of romatic diamine monomer containing rigid-rod amide bonds in the molecular chains by one-step high temperature solution polycondensation reaction, respectively. And then three kinds of transparent PI films were prepared by the N,N-dimethylacetamide (DMAc) solution of the above resins. The films were tested by attenuated total reflection Fourier transform infrared spectroscopy, thermogravimetric analysis, dynamic mechanical analysis, thermomechanical analysis, and UV-visible spectrum, and their yellowness index was tested. The results show that the PI films exhibit good optical transparency, their ultraviolet cutoff wavelength is below 380 nm and the optical transmittance is over 80% at the wavelength of 500 nm. In addition, the PI films exhibit good thermal stability with the glass transition temperatures (Tg) higher than 320℃ and the 5% weight loss temperatures (T5%) over 520℃. The linear thermal expansion coefficients (CTE) of the PI films are all lower than 50×10-6/K, indicating that the introducing of rigid amide bonds can efficiently enhance the high-temperature dimensional stability of the solution-processable fluoro-containing PI films.

polyimide  /  fluoro-containing groups  /  optical properties  /  thermal properties  /  linear thermal expansion coefficients
Hanli WANG, Lin WU, Xinxin ZHI, Yanshuang GAO, Yan ZHANG, Jingang LIU. Preparation and Properties of Solution-processable Transparent Fluoro-containing Polyimide Films with Low Thermal Expansion[J]. Insulating Materials, 2022 , 55 (10) : 6 -13 . DOI: 10.16790/j.cnki.1009-9239.im.2022.10.002
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2022.10.002
  • Receive Date：2021-11-06
  • Online Date：2025-12-23
  • Published：2022-10-20
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History
  • Received：2021-11-06
  • Revised：2021-12-04
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    1Shandong Huaxiashenzhou New Material Co., Ltd., Zibo 256401, China
    2School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2022.10.002
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表12种不同金属材料的力学参数
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Family		 属数
Number of
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Number of
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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