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Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN
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Liyi YANG1, 2, Fan GE2, Wei WANG1, Yanfei LI2, Miao MA2, Tao RAN2
Insulating Materials | 2024, 57(6) : 17 - 22
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Insulating Materials | 2024, 57(6): 17-22
Material Research
Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN
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Liyi YANG1, 2, Fan GE2, Wei WANG1, Yanfei LI2, Miao MA2, Tao RAN2
Affiliations
  • 1Jiaxing University, Jiaxing 314001, China
  • 2Zhejiang Rongtai Technical Industry Co., Ltd., Jiaxing 314007, China
Published: 2024-06-20 doi: 10.16790/j.cnki.1009-9239.im.2024.06.003
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Epoxy resin (EP) has been widely applied in electrical insulating materials, but with a low thermal conductivity, it cannot meet the requirement of heat dissipation in modern electrical equipment with high-power density. In this paper, silver acetate (AgAc) and 2-ethyl-4-methylimidazole (2E4MI) complex was deposited on boron nitride (BN) surface to prepare imidazole-silver modified BN hybrid materials (Ag(2E4MI)2Ac@BN), then Ag(2E4MI)2Ac@BN was filled in EP to prepare Ag(2E4MI)2Ac@BN/EP composites,and its thermal conductivity was studied. The results show that when the volume fraction of filler is 20%, the thermal conductivity of Ag(2E4MI)2Ac@BN/EP composites is 1.72 W/(m·K), which is 79.2% higher than that of BN/EP composites (0.96 W/(m·K)). The results of Monte Carlo simulation show that in the EP matrix, the thermal contact resistance (Rc) of Ag(2E4MI)2Ac@BN is 2.7×106 K/W, which is lower than the that of BN (Rc=5.5×106 K/W). In comparison with BN/EP composites, Ag(2E4MI)2Ac@BN/EP composites exhibit higher tensile strength and dielectric loss tangent (tanδ), lower dielectric strength and volume resistivity, while maintain good electrical insulating properties.

composites  /  epoxy resin  /  BN  /  thermal conductive  /  electrical insulation
Liyi YANG, Fan GE, Wei WANG, Yanfei LI, Miao MA, Tao RAN. Thermal conductive and insulating epoxy composites filled with imidazole-silver modified BN[J]. Insulating Materials, 2024 , 57 (6) : 17 -22 . DOI: 10.16790/j.cnki.1009-9239.im.2024.06.003
Year 2024 volume 57 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2024.06.003
  • Receive Date:2022-04-15
  • Online Date:2025-12-22
  • Published:2024-06-20
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  • Received:2022-04-15
  • Revised:2022-05-27
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    1Jiaxing University, Jiaxing 314001, China
    2Zhejiang Rongtai Technical Industry Co., Ltd., Jiaxing 314007, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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