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Research on sintering process of glass insulating layer on surface of oxygen-free copper
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Liangliang WU1, 2, Lizhen LIANG2, Yuzhong QIAN2, Xun LÜ3, Jichan XU1, Xiancai MENG2, Xin TAO1, Chundong HU2
Insulating Materials | 2024, 57(4) : 82 - 87
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Insulating Materials | 2024, 57(4): 82-87
• Insulation Technology •
Research on sintering process of glass insulating layer on surface of oxygen-free copper
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Liangliang WU1, 2, Lizhen LIANG2, Yuzhong QIAN2, Xun LÜ3, Jichan XU1, Xiancai MENG2, Xin TAO1, Chundong HU2
Affiliations
  • 1School of Mechanical and Electrical Engineering, Anhui University of Science and Technology, Huainan 232001, China
  • 2Institute of Energy, Hefei Comprehensive National Science Center, Hefei 230031, China
  • 3School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China
Published: 2024-04-20 doi: 10.16790/j.cnki.1009-9239.im.2024.04.012
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In order to solve the problem of turn-to-turn insulation for oxygen-free copper coils in radio frequency plasma of antenna built-in type, a process capable of sintering a glass insulating layer on the surface of oxygen-free copper was studied, and the effects of factors such as different surface treatment method, binder, and sintering temperature of the process on the performance of glass insulating layer were investigated in detail. The results show that the oxygen-free copper surface after acid washing pretreatment can significantly improve the wettability of low-temperature glaze on the copper surface compare to alkali washing, and reducing the "porosity" on the insulating layer surface. At the same time, an appropriate adding amount of Na2SiO3-5H2O binder can improve the interface combination effect between the glass insulating layer and the copper surface, and improve the hardness of glass insulating layer surface. In addition, the surface hardness of the insulating layer increases with the increase of the sintering temperature, and the number of "porosity" on the insulating layer surface is gradually reduced. An oxygen-free copper coil antenna with a glass insulating layer on the surface was finally prepared according to this process, which achieved a long-time discharge maintenance and effectively solved the turn-to-turn insulation problem during discharge process.

glass insulation  /  low temperature glaze  /  surface treatment method  /  binder  /  sintering temperature
Liangliang WU, Lizhen LIANG, Yuzhong QIAN, Xun LÜ, Jichan XU, Xiancai MENG, Xin TAO, Chundong HU. Research on sintering process of glass insulating layer on surface of oxygen-free copper[J]. Insulating Materials, 2024 , 57 (4) : 82 -87 . DOI: 10.16790/j.cnki.1009-9239.im.2024.04.012
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Year 2024 volume 57 Issue 4
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2024.04.012
  • Receive Date：2023-10-11
  • Online Date：2025-12-22
  • Published：2024-04-20
Article Data
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History
  • Received：2023-10-11
  • Revised：2023-12-25
Funding
Affiliations
    1School of Mechanical and Electrical Engineering, Anhui University of Science and Technology, Huainan 232001, China
    2Institute of Energy, Hefei Comprehensive National Science Center, Hefei 230031, China
    3School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.04.012
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
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Genus		 种数
Number of
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Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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