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Study on polyimide films for novel OLED flexible substrate
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Taoqi LI1, 2, Yuwei ZHOU1, Ali CAI1, Qizhao NIE1, Xiaoxu LIU3
Insulating Materials | 2024, 57(3) : 29 - 35
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Insulating Materials | 2024, 57(3): 29-35
Material Research
Study on polyimide films for novel OLED flexible substrate
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Taoqi LI1, 2, Yuwei ZHOU1, Ali CAI1, Qizhao NIE1, Xiaoxu LIU3
Affiliations
  • 1Datong Co Polymer (Xiʹan) Technology Co., Ltd., Xiʹan 710075, China
  • 2Xiʹan Modern Chemistry Research Institute, Xiʹan 710065, China
  • 3School of Material Science and Engineering, Shaanxi University of Science and Technology, Xiʹan 710021, China
Published: 2024-03-20 doi: 10.16790/j.cnki.1009-9239.im.2024.03.004
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In this study, 4,4ʹ-diaminobenzanilide (DABA), 2,2ʹ-dimethyl-[1,1ʹ-biphenyl]-4,4ʹ-diamine (m-TB), dianhydrides pyromellitic dianhydride (PMDA), and 4,4ʹ-oxybisphthalic anhydride (ODPA) were used as raw materials, and a polyimide (PI) film for oganic light emitting diodes (OLED) flexible substrates was successfully synthesized. The results show that when the molar ratio of diamine to dianhydride is 0.990, the feeding time is 120 min, the reaction temperature is 0-30℃, the stirring speed is 200-250 r/min, and the reaction time is 240 min, the gel amount during the synthesis of polyamide acid is small, and viscosity can meet the requirements of industrial synthesis. After thermal imimization at 400℃, the glass transition temperature of the polyimide film is 450℃, the 1% weight loss temperature is 554℃, the thermal expansion coefficient is 4.1×10-6 K-1, the tensile strength is 326.9 MPa, the tensile modulus is 9 572.8 MPa, the electric strength is 623 kV/mm, and the dielectric constant is 3.251, which meet the industrial application requirements of OLED flexible substrate.

OLED  /  flexible substrate  /  polyimide films  /  in-situ polymerization  /  thermal performance
Taoqi LI, Yuwei ZHOU, Ali CAI, Qizhao NIE, Xiaoxu LIU. Study on polyimide films for novel OLED flexible substrate[J]. Insulating Materials, 2024 , 57 (3) : 29 -35 . DOI: 10.16790/j.cnki.1009-9239.im.2024.03.004
Year 2024 volume 57 Issue 3
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doi: 10.16790/j.cnki.1009-9239.im.2024.03.004
  • Receive Date:2023-09-30
  • Online Date:2025-12-22
  • Published:2024-03-20
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  • Received:2023-09-30
  • Revised:2024-01-15
Affiliations
    1Datong Co Polymer (Xiʹan) Technology Co., Ltd., Xiʹan 710075, China
    2Xiʹan Modern Chemistry Research Institute, Xiʹan 710065, China
    3School of Material Science and Engineering, Shaanxi University of Science and Technology, Xiʹan 710021, China
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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