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Preparation and Characterization of Single Component High Thermal Conductive Structural Adhesive for Chip Packaging
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Huilu LI, Furong NI, Gang WANG, Ting XIA, Pan ZHANG, Ying LI
Insulating Materials | 2022, 55(3) : 38 - 44
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Insulating Materials | 2022, 55(3): 38-44
• Material Research •
Preparation and Characterization of Single Component High Thermal Conductive Structural Adhesive for Chip Packaging
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Huilu LI, Furong NI, Gang WANG, Ting XIA, Pan ZHANG, Ying LI
Affiliations
  • College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China
Published: 2022-03-20 doi: 10.16790/j.cnki.1009-9239.im.2022.03.005
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A low viscosity, fast-curing single component thermally conductive structural adhesive base glue was prepared by using bisphenol A epoxy resin E124 as the main resin, polythiol as the curing agent, and imidazole as the accelerator, its curing process was discussed by surface drying time and gel time test and DSC test. A thermal conductive structural adhesive was prepared by adding thermal conductive fillers, and the particle size, shape and amount of fillers on the properties were studied. The results show that when the mass ratio of the base glue to two different sizes of alumina, which is m(base glue): m(40 μm Al2O3):m(2 μm Al2O3)=15:7:3, m(base glue): m(40 μm Al2O3):m(5 μm Al2O3)=15:7:3, m(base glue):m(40 μm Al2O3):m(10 μm Al2O3)=15:8:2, the three high thermal conductive structural adhesives could cure at 90℃ in 15 min. Their thermal conductivity is 2.46, 2.59, and 2.42 W/(m·K), adhesive strength is 5.92, 6.46, and 6.49 MPa, viscosity is 63 800, 74 100, and 87 000 mPa·s, respectively, which meets the basic performance requirements of screen printing process and chip package heat dissipation materials.

epoxy resin  /  polymercaptan curing agent  /  thermal conductivity  /  adhesive strength  /  filler
Huilu LI, Furong NI, Gang WANG, Ting XIA, Pan ZHANG, Ying LI. Preparation and Characterization of Single Component High Thermal Conductive Structural Adhesive for Chip Packaging[J]. Insulating Materials, 2022 , 55 (3) : 38 -44 . DOI: 10.16790/j.cnki.1009-9239.im.2022.03.005
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doi: 10.16790/j.cnki.1009-9239.im.2022.03.005
  • Receive Date：2021-05-11
  • Online Date：2025-12-22
  • Published：2022-03-20
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History
  • Received：2021-05-11
  • Revised：2021-06-07
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    College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2022.03.005
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
total species (%)		 属
Genus		 种数
Number of
species		 占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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