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Research progress on high temperature resistant epoxy molding compounds for power electronic packaging in electrical vehicles
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Xiaolei WANG1, Yousheng ZHANG2, Shengwei DAI1, Yuang LIU1, Xuanzhe DU1, Xi REN1, Jingang LIU1
Insulating Materials | 2024, 57(1) : 9 - 17
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Insulating Materials | 2024, 57(1): 9-17
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Research progress on high temperature resistant epoxy molding compounds for power electronic packaging in electrical vehicles
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Xiaolei WANG1, Yousheng ZHANG2, Shengwei DAI1, Yuang LIU1, Xuanzhe DU1, Xi REN1, Jingang LIU1
Affiliations
  • 1Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
  • 2Zhejiang Jameen New Material Co., Ltd., Jiaxing 314011, China
Published: 2024-01-20 doi: 10.16790/j.cnki.1009-9239.im.2024.01.002
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In this paper, the basic research and application progress of high temperature resistant epoxy molding compound (EMC) at home and abroad in recent years were reviewed. The property requirements of advanced power electronics on the molding compound, the high temperature degradation mechanism of traditional EMC, the relationship between structure and thermal stability of EMC, and the modification pathways for improving the thermal stability of EMC were presented. Especially, the development status of multi-aromatic ring (MAR) and naphthalene-containing EMC were reviewed. At last, the future development trends of high temperature resistant EMC for power electronic packaging were prospected.

power electronic packaging  /  epoxy molding compound  /  high temperature resistance  /  epoxy resin  /  phenolic resin
Xiaolei WANG, Yousheng ZHANG, Shengwei DAI, Yuang LIU, Xuanzhe DU, Xi REN, Jingang LIU. Research progress on high temperature resistant epoxy molding compounds for power electronic packaging in electrical vehicles[J]. Insulating Materials, 2024 , 57 (1) : 9 -17 . DOI: 10.16790/j.cnki.1009-9239.im.2024.01.002
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2024.01.002
  • Receive Date：2023-01-27
  • Online Date：2025-12-22
  • Published：2024-01-20
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History
  • Received：2023-01-27
  • Revised：2023-03-23
Funding
Affiliations
    1Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources, School of Materials Science and Technology, China University of Geosciences, Beijing 100083, China
    2Zhejiang Jameen New Material Co., Ltd., Jiaxing 314011, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2024.01.002
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表12种不同金属材料的力学参数
科
Family		 属数
Number of
genus		 种数
Number of
species		 占总种数比例
Percentage of
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Genus		 种数
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Percentage of total
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鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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