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Investigation of negative photosensitive polyimide resin synthesis through chlorine-free polyisoimide strategy
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Shengcheng ZHANG1, Yanping ZHAO1, Jianan YUAN2, Chenghui DENG3, Qinghua LU2
Insulating Materials | 2025, 58(6) : 16 - 24
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Insulating Materials | 2025, 58(6): 16-24
Special Issue on High Performance Polyimide Materials
Investigation of negative photosensitive polyimide resin synthesis through chlorine-free polyisoimide strategy
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Shengcheng ZHANG1, Yanping ZHAO1, Jianan YUAN2, Chenghui DENG3, Qinghua LU2
Affiliations
  • 1. MINSEOA Advanced Materials Co., Ltd., Jinan 250000, China
  • 2. School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
  • 3. School of Chemical Science and Engineering, Tongji University, Shanghai 200092, China
Published: 2025-06-20 doi: 10.16790/j.cnki.1009-9239.im.2025.06.003
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Photosensitive polyimide (PSPI) has a unique role in semiconductor packaging, among them, ester-type PSPIs containing acrylic acid derivatives are widely used in industry. Generally, the PSPIs are synthesized by the well-established chloride method, but chloride ions are introduced during the synthesis process, which negatively affects the reaction apparatus, resin purification, and the environment. For the development of green and reliable synthesis methods, we explored the reaction process for the preparation of hydroxyethyl methacrylate PSPI by polyisoimide using 4,4′-diaminodiphenyl ether (ODA) and 4,4′-biphenyl ether dianhydride (ODPA) as the polymerized monomers. The effect of solid content, solvent, and reaction temperature on the gel formation during the synthesis process of PSPI was discussed. The photolithographic and thermo-mechanical properties of PSPI prepared by the polyisoimide method were investigated. The results demonstrate that the PSPI prepared by this method has good photolithographic patterning ability (for a film with thickness of 4.5 μm, circular holes can be opened at a diameter of 15 μm, and the film retention rate is ≥90%) and excellent thermal properties and mechanical properties (Td5%=471℃, Tg=297℃, and tensile strength is 127.5 MPa). There are no Cl-ions introduction during synthsis process, and the process is green and friendly, and simplified with a short reaction cycle. The method was extended to the preparation of other four PSPI systems, and the isomerization method is found to be universal, and this efficient and green synthesis method provides theoretical guidance for the preparation of high-performance PSPI photoresists in laboratories and enterprises.

photosensitive polyimide  /  negative photoresist  /  green synthesis  /  polyisoimide  /  patterning
Shengcheng ZHANG, Yanping ZHAO, Jianan YUAN, Chenghui DENG, Qinghua LU. Investigation of negative photosensitive polyimide resin synthesis through chlorine-free polyisoimide strategy[J]. Insulating Materials, 2025 , 58 (6) : 16 -24 . DOI: 10.16790/j.cnki.1009-9239.im.2025.06.003
Year 2025 volume 58 Issue 6
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Article Info
doi: 10.16790/j.cnki.1009-9239.im.2025.06.003
  • Receive Date:2024-11-13
  • Online Date:2025-12-04
  • Published:2025-06-20
Article Data
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History
  • Received:2024-11-13
  • Revised:2024-12-19
Funding
Affiliations
    1. MINSEOA Advanced Materials Co., Ltd., Jinan 250000, China
    2. School of Chemistry and Chemical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
    3. School of Chemical Science and Engineering, Tongji University, Shanghai 200092, China
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https://castjournals.cast.org.cn/joweb/jycl/EN/10.16790/j.cnki.1009-9239.im.2025.06.003
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表12种不同金属材料的力学参数

Family
属数
Number of
genus
种数
Number of
species
占总种数比例
Percentage of
total species (%)

Genus
种数
Number of
species
占总种数比例
Percentage of total
species (%)
鹅膏菌科Amanitaceae 2 11 5.26 鹅膏菌属 Amanita 10 4.78
小菇科 Mycenaceae 2 12 5.74 丝盖伞属 Inocybe 5 2.39
多孔菌科 Polyporaceae 8 14 6.70 蜡蘑属 Laccaria 5 2.39
红菇科 Russulaceae 3 23 11.00 小皮伞属 Marasmius 6 2.87
小菇属 Mycena 11 5.26
光柄菇属 Pluteus 5 2.39
红菇属 Russula 17 8.13
栓菌属 Trametes 5 2.39
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